Microwave Packaging for Voltage Standard Applications

Improved packages for Josephson Voltage Standard (JVS) circuits have increased operating margins, reliability, and longevity of JVS systems. By using the ldquoflip-chip-on-flexrdquo technique, reliable chip and cryoprobe mounting have been demonstrated. The microwave structures on these packages hav...

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Veröffentlicht in:	IEEE transactions on applied superconductivity 2009-06, Vol.19 (3), p.1012-1015
Hauptverfasser:	Elsbury, M.M., Burroughs, C.J., Dresselhaus, P.D., Popovic, Z.B., Benz, S.P.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Chips Circuits Coplanar transmission lines Cryogenic electronics Design engineering Design. Technologies. Operation analysis. Testing Electric potential Electrical engineering. Electrical power engineering Electrical power engineering Electromagnets Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Finite element methods Frequency Insertion loss integrated circuit packaging Integrated circuits Josephson arrays Josephson device packaging Microstrip components Microwaves Packages Packaging Power networks and lines Power system reliability Power transmission lines Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Spectrum allocation superconducting device packaging superconducting integrated circuits superconducting microwave devices Transmission lines Users connections and in door installation Various equipment and components Voltage
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