Microwave Packaging for Voltage Standard Applications
Improved packages for Josephson Voltage Standard (JVS) circuits have increased operating margins, reliability, and longevity of JVS systems. By using the ldquoflip-chip-on-flexrdquo technique, reliable chip and cryoprobe mounting have been demonstrated. The microwave structures on these packages hav...
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| Veröffentlicht in: | IEEE transactions on applied superconductivity 2009-06, Vol.19 (3), p.1012-1015 |
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| container_title | IEEE transactions on applied superconductivity |
| container_volume | 19 |
| creator | Elsbury, M.M. Burroughs, C.J. Dresselhaus, P.D. Popovic, Z.B. Benz, S.P. |
| description | Improved packages for Josephson Voltage Standard (JVS) circuits have increased operating margins, reliability, and longevity of JVS systems. By using the ldquoflip-chip-on-flexrdquo technique, reliable chip and cryoprobe mounting have been demonstrated. The microwave structures on these packages have been improved such that more power can be delivered to the JVS chip over a wider frequency range: DC to over 30 GHz. Detailed finite-element simulations were performed to optimize the chip-to-flex launches as well as the on-flex transmission lines. It was found that coplanar waveguide transmission line designs had improved insertion and return losses compared to those of the microstrip transmission line designs, in large part due to the large discontinuities associated with through-substrate vias for microstrip ground connections. The improved coplanar-waveguide package/probe yielded insertion loss dominated by the ~ 0.25 dB/GHz cable loss and VSWR better than 2:1 for the entire 0-30 GHz band. Substantially larger JVS system operating margins were measured using the coplanar-waveguide package; for a 5120 junction array a quantized voltage step greater than 1 mA bias current range is shown for a 10-30 GHz band. |
| doi_str_mv | 10.1109/TASC.2009.2018766 |
| format | Article |
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By using the ldquoflip-chip-on-flexrdquo technique, reliable chip and cryoprobe mounting have been demonstrated. The microwave structures on these packages have been improved such that more power can be delivered to the JVS chip over a wider frequency range: DC to over 30 GHz. Detailed finite-element simulations were performed to optimize the chip-to-flex launches as well as the on-flex transmission lines. It was found that coplanar waveguide transmission line designs had improved insertion and return losses compared to those of the microstrip transmission line designs, in large part due to the large discontinuities associated with through-substrate vias for microstrip ground connections. The improved coplanar-waveguide package/probe yielded insertion loss dominated by the ~ 0.25 dB/GHz cable loss and VSWR better than 2:1 for the entire 0-30 GHz band. Substantially larger JVS system operating margins were measured using the coplanar-waveguide package; for a 5120 junction array a quantized voltage step greater than 1 mA bias current range is shown for a 10-30 GHz band.</description><identifier>ISSN: 1051-8223</identifier><identifier>EISSN: 1558-2515</identifier><identifier>DOI: 10.1109/TASC.2009.2018766</identifier><identifier>CODEN: ITASE9</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Chips ; Circuits ; Coplanar transmission lines ; Cryogenic electronics ; Design engineering ; Design. Technologies. Operation analysis. Testing ; Electric potential ; Electrical engineering. Electrical power engineering ; Electrical power engineering ; Electromagnets ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronics ; Exact sciences and technology ; Finite element methods ; Frequency ; Insertion loss ; integrated circuit packaging ; Integrated circuits ; Josephson arrays ; Josephson device packaging ; Microstrip components ; Microwaves ; Packages ; Packaging ; Power networks and lines ; Power system reliability ; Power transmission lines ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Spectrum allocation ; superconducting device packaging ; superconducting integrated circuits ; superconducting microwave devices ; Transmission lines ; Users connections and in door installation ; Various equipment and components ; Voltage</subject><ispartof>IEEE transactions on applied superconductivity, 2009-06, Vol.19 (3), p.1012-1015</ispartof><rights>2009 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2009</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c354t-db8ca740dfe480132ef079230dc2f0052d237095ef83feec9809467029bce3f33</citedby><cites>FETCH-LOGICAL-c354t-db8ca740dfe480132ef079230dc2f0052d237095ef83feec9809467029bce3f33</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5129608$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,314,776,780,785,786,792,23910,23911,25119,27903,27904,54736</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5129608$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=21991523$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Elsbury, M.M.</creatorcontrib><creatorcontrib>Burroughs, C.J.</creatorcontrib><creatorcontrib>Dresselhaus, P.D.</creatorcontrib><creatorcontrib>Popovic, Z.B.</creatorcontrib><creatorcontrib>Benz, S.P.</creatorcontrib><title>Microwave Packaging for Voltage Standard Applications</title><title>IEEE transactions on applied superconductivity</title><addtitle>TASC</addtitle><description>Improved packages for Josephson Voltage Standard (JVS) circuits have increased operating margins, reliability, and longevity of JVS systems. By using the ldquoflip-chip-on-flexrdquo technique, reliable chip and cryoprobe mounting have been demonstrated. The microwave structures on these packages have been improved such that more power can be delivered to the JVS chip over a wider frequency range: DC to over 30 GHz. Detailed finite-element simulations were performed to optimize the chip-to-flex launches as well as the on-flex transmission lines. It was found that coplanar waveguide transmission line designs had improved insertion and return losses compared to those of the microstrip transmission line designs, in large part due to the large discontinuities associated with through-substrate vias for microstrip ground connections. The improved coplanar-waveguide package/probe yielded insertion loss dominated by the ~ 0.25 dB/GHz cable loss and VSWR better than 2:1 for the entire 0-30 GHz band. Substantially larger JVS system operating margins were measured using the coplanar-waveguide package; for a 5120 junction array a quantized voltage step greater than 1 mA bias current range is shown for a 10-30 GHz band.</description><subject>Applied sciences</subject><subject>Chips</subject><subject>Circuits</subject><subject>Coplanar transmission lines</subject><subject>Cryogenic electronics</subject><subject>Design engineering</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electric potential</subject><subject>Electrical engineering. Electrical power engineering</subject><subject>Electrical power engineering</subject><subject>Electromagnets</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Finite element methods</subject><subject>Frequency</subject><subject>Insertion loss</subject><subject>integrated circuit packaging</subject><subject>Integrated circuits</subject><subject>Josephson arrays</subject><subject>Josephson device packaging</subject><subject>Microstrip components</subject><subject>Microwaves</subject><subject>Packages</subject><subject>Packaging</subject><subject>Power networks and lines</subject><subject>Power system reliability</subject><subject>Power transmission lines</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Spectrum allocation</subject><subject>superconducting device packaging</subject><subject>superconducting integrated circuits</subject><subject>superconducting microwave devices</subject><subject>Transmission lines</subject><subject>Users connections and in door installation</subject><subject>Various equipment and components</subject><subject>Voltage</subject><issn>1051-8223</issn><issn>1558-2515</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdUE1LAzEUDKJgrf4A8bII4mnrS7LZTY6l-AUVhVavIc2-lNTtbk22iv_eXVp68PLegzczzAwhlxRGlIK6m49nkxEDUN2gssjzIzKgQsiUCSqOuxsETSVj_JScxbgCoJnMxICIF29D82O-MXkz9tMsfb1MXBOSj6ZqzRKTWWvq0oQyGW82lbem9U0dz8mJM1XEi_0ekveH-_nkKZ2-Pj5PxtPUcpG1abmQ1hQZlA4zCZQzdFAoxqG0zAEIVjJegBLoJHeIVklQWV4AUwuL3HE-JLc73U1ovrYYW7320WJVmRqbbdRSKi4ZV1mHvP6HXDXbUHfmtKIMslx12YeE7kBd5BgDOr0Jfm3Cr6ag-xp1X6Pua9T7GjvOzV7YRGsqF0xtfTwQGVWKCtZbvdrhPCIe3oIylYPkf1fpeVA</recordid><startdate>20090601</startdate><enddate>20090601</enddate><creator>Elsbury, M.M.</creator><creator>Burroughs, C.J.</creator><creator>Dresselhaus, P.D.</creator><creator>Popovic, Z.B.</creator><creator>Benz, S.P.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20090601</creationdate><title>Microwave Packaging for Voltage Standard Applications</title><author>Elsbury, M.M. ; Burroughs, C.J. ; Dresselhaus, P.D. ; Popovic, Z.B. ; Benz, S.P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c354t-db8ca740dfe480132ef079230dc2f0052d237095ef83feec9809467029bce3f33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Applied sciences</topic><topic>Chips</topic><topic>Circuits</topic><topic>Coplanar transmission lines</topic><topic>Cryogenic electronics</topic><topic>Design engineering</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electric potential</topic><topic>Electrical engineering. Electrical power engineering</topic><topic>Electrical power engineering</topic><topic>Electromagnets</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Finite element methods</topic><topic>Frequency</topic><topic>Insertion loss</topic><topic>integrated circuit packaging</topic><topic>Integrated circuits</topic><topic>Josephson arrays</topic><topic>Josephson device packaging</topic><topic>Microstrip components</topic><topic>Microwaves</topic><topic>Packages</topic><topic>Packaging</topic><topic>Power networks and lines</topic><topic>Power system reliability</topic><topic>Power transmission lines</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Spectrum allocation</topic><topic>superconducting device packaging</topic><topic>superconducting integrated circuits</topic><topic>superconducting microwave devices</topic><topic>Transmission lines</topic><topic>Users connections and in door installation</topic><topic>Various equipment and components</topic><topic>Voltage</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Elsbury, M.M.</creatorcontrib><creatorcontrib>Burroughs, C.J.</creatorcontrib><creatorcontrib>Dresselhaus, P.D.</creatorcontrib><creatorcontrib>Popovic, Z.B.</creatorcontrib><creatorcontrib>Benz, S.P.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on applied superconductivity</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Elsbury, M.M.</au><au>Burroughs, C.J.</au><au>Dresselhaus, P.D.</au><au>Popovic, Z.B.</au><au>Benz, S.P.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microwave Packaging for Voltage Standard Applications</atitle><jtitle>IEEE transactions on applied superconductivity</jtitle><stitle>TASC</stitle><date>2009-06-01</date><risdate>2009</risdate><volume>19</volume><issue>3</issue><spage>1012</spage><epage>1015</epage><pages>1012-1015</pages><issn>1051-8223</issn><eissn>1558-2515</eissn><coden>ITASE9</coden><abstract>Improved packages for Josephson Voltage Standard (JVS) circuits have increased operating margins, reliability, and longevity of JVS systems. By using the ldquoflip-chip-on-flexrdquo technique, reliable chip and cryoprobe mounting have been demonstrated. The microwave structures on these packages have been improved such that more power can be delivered to the JVS chip over a wider frequency range: DC to over 30 GHz. Detailed finite-element simulations were performed to optimize the chip-to-flex launches as well as the on-flex transmission lines. It was found that coplanar waveguide transmission line designs had improved insertion and return losses compared to those of the microstrip transmission line designs, in large part due to the large discontinuities associated with through-substrate vias for microstrip ground connections. The improved coplanar-waveguide package/probe yielded insertion loss dominated by the ~ 0.25 dB/GHz cable loss and VSWR better than 2:1 for the entire 0-30 GHz band. Substantially larger JVS system operating margins were measured using the coplanar-waveguide package; for a 5120 junction array a quantized voltage step greater than 1 mA bias current range is shown for a 10-30 GHz band.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TASC.2009.2018766</doi><tpages>4</tpages></addata></record> |
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| ispartof | IEEE transactions on applied superconductivity, 2009-06, Vol.19 (3), p.1012-1015 |
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| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Chips Circuits Coplanar transmission lines Cryogenic electronics Design engineering Design. Technologies. Operation analysis. Testing Electric potential Electrical engineering. Electrical power engineering Electrical power engineering Electromagnets Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Finite element methods Frequency Insertion loss integrated circuit packaging Integrated circuits Josephson arrays Josephson device packaging Microstrip components Microwaves Packages Packaging Power networks and lines Power system reliability Power transmission lines Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Spectrum allocation superconducting device packaging superconducting integrated circuits superconducting microwave devices Transmission lines Users connections and in door installation Various equipment and components Voltage |
| title | Microwave Packaging for Voltage Standard Applications |
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