A new global finite element analysis of microwave circuits including lumped elements

A new global finite element analysis of microwave circuits including lumped elements

A new fullwave global analysis of complex inhomogeneous structures including passive or active, linear or non linear lumped elements is presented. Only one electromagnetic simulation of the distributed part, by a 3D finite element method using edge elements, is needed corresponding to the insertion...

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Bibliographische Detailangaben
Hauptverfasser: Guillouard, K., Wong, M.F., Hanna, V.F., Citerne, J.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Admittance
Capacitors
Circuit analysis
Circuit simulation
Diodes
Finite element methods
Maxwell equations
Microwave circuits
Resistors
Transmission line matrix methods
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Beschreibung
Zusammenfassung:A new fullwave global analysis of complex inhomogeneous structures including passive or active, linear or non linear lumped elements is presented. Only one electromagnetic simulation of the distributed part, by a 3D finite element method using edge elements, is needed corresponding to the insertion of several lumped elements placed at the same position. Results for a resistor, a diode inserted in a microstrip circuit as well as a Gunn diode amplifier are presented and comparisons with measurements are given for an active structure.
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.1996.508529