Effect of initial anodic dissolution current on the electrochemical migration phenomenon of Sn solder

As electronic packages become smaller in size, the pitch of metal line is getting shorter. Decrease of line pitch in electronic packages and substrate of electronic component causes the electrochemical migration (ECM) more frequently. If the electronic components are exposed to high temperature and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shin-Bok Lee, Min-Suk Jung, Ho-Young Lee, Young-Chang Joo
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Electrochemical machining Electronic components Electronics packaging Humidity Insulation Lead Temperature Testing Tin Voltage
Online-Zugang:	Volltext bestellen
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