3D via belt technology

Three-dimensional die stacking with vertical interconnections through Si dies is potentially the best semiconductor system integration technique. With its incredibly promising improvements in speed and power dissipation in IC's, it has attracted increased attention in recent times. But this app...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Brun, J., Boutry, H., Franiatte, R., Hilt, T., Sillon, N.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Belts Copper Integrated circuit interconnections Manufacturing Packaging Power system interconnection Silicon Stacking Testing Wafer scale integration
Online-Zugang:	Volltext bestellen
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