Proximity Communication flip-chip package with micron chip-to-chip alignment tolerances

As performance gains from scaling silicon slow, improvements in system performance must come from tighter integration. Proximity communication (PxC) enables designers to aggregate multiple chips that perform as a single large piece of silicon. PxC enables the heterogeneous integration of an optimize...

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Bibliographische Detailangaben

Hauptverfasser:	Sze, T., Giere, M., Guenin, B., Nettleton, N., Popovic, D., Shi, J., Bezuk, S., Ho, R., Drost, R., Douglas, D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aggregates Bandwidth CMOS process CMOS technology Delay Flash memory Packaging Performance gain Silicon System performance
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