Parametric acceleration transforms for lead-free solder joint reliability under thermal cycling conditions

The conversion to Pb-free solders has already been implemented in the consumer market. However, the transition to Pb-free solders in the high performance, mission critical networking/server industry has not yet been fully implemented. A significant factor in the slow transition to Pb-free solders is...

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Bibliographische Detailangaben

Hauptverfasser:	Ahmad, M., Weidong Xie, Kuo-Chuan Liu, Jie Xue, Towne, D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Acceleration Assembly Environmentally friendly manufacturing techniques Lead Life estimation Life testing Mission critical systems Network servers Packaging Soldering
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