Precision improvement study of thermal warpage prediction technology for LSI packages

A finer interconnection pitch of LSI packages has enhanced the importance of precise prediction technology of temperature-dependent warpage. In our research, we prepared a model package with minute wiring and vias, and examined a method of improving the agreement accuracy between numerical analysis...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kurashina, M., Mizutani, D., Koide, M., Itoh, N.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Heating Large scale integration Material properties Numerical analysis Packaging Predictive models Temperature distribution Temperature measurement Thermal conductivity Wiring
Online-Zugang:	Volltext bestellen
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