A 300 GHz mHEMT amplifier module

In this paper, we present the development of an H-band (220 - 325 GHz) submillimeter-wave monolithic integrated circuit (S-MMIC) amplifier module for use in next generation active and passive high-resolution imaging systems operating around 300 GHz. Therefore, a variety of compact amplifier circuits...

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Hauptverfasser: Tessmann, A., Leuther, A., Hurm, V., Massler, H., Zink, M., Kuri, M., Riessle, M., Losch, R., Schlechtweg, M., Ambacher, O.
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creator Tessmann, A.
Leuther, A.
Hurm, V.
Massler, H.
Zink, M.
Kuri, M.
Riessle, M.
Losch, R.
Schlechtweg, M.
Ambacher, O.
description In this paper, we present the development of an H-band (220 - 325 GHz) submillimeter-wave monolithic integrated circuit (S-MMIC) amplifier module for use in next generation active and passive high-resolution imaging systems operating around 300 GHz. Therefore, a variety of compact amplifier circuits has been realized by using an advanced 35 nm InAlAs/InGaAs based depletion-type metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar waveguide (GCPW) circuit topology. A single-stage cascode design achieved a small-signal gain of 5.6 dB at 300 GHz and a linear gain of more than 5 dB between 258 and 308 GHz. Additionally, a four-stage amplifier S-MMIC based on conventional devices in common-source configuration was realized, demonstrating a maximum gain of 15.6 dB at 276 GHz and a linear gain of more than 12 dB over the frequency range from 264 to 300 GHz. Finally, mounting and packaging of the monolithic amplifier chips into H-band waveguide modules was accomplished with only minor reduction in circuit performance.
doi_str_mv 10.1109/ICIPRM.2009.5012477
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Therefore, a variety of compact amplifier circuits has been realized by using an advanced 35 nm InAlAs/InGaAs based depletion-type metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar waveguide (GCPW) circuit topology. A single-stage cascode design achieved a small-signal gain of 5.6 dB at 300 GHz and a linear gain of more than 5 dB between 258 and 308 GHz. Additionally, a four-stage amplifier S-MMIC based on conventional devices in common-source configuration was realized, demonstrating a maximum gain of 15.6 dB at 276 GHz and a linear gain of more than 12 dB over the frequency range from 264 to 300 GHz. Finally, mounting and packaging of the monolithic amplifier chips into H-band waveguide modules was accomplished with only minor reduction in circuit performance.</abstract><pub>IEEE</pub><doi>10.1109/ICIPRM.2009.5012477</doi><tpages>4</tpages></addata></record>
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Gain
HEMTs
High-resolution imaging
Indium compounds
Indium gallium arsenide
mHEMTs
MODFETs
Monolithic integrated circuits
Submillimeter wave integrated circuits
Submillimeter wave technology
title A 300 GHz mHEMT amplifier module
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