Application of stress sensing test chips to area array packaging

Thermal cycling accelerated life testing is often used to qualify area array packages (e.g. Ball Grid Arrays and Flip Chip) for various applications. Finite element life predictions for thermal cycling configurations are challenging due to the complicated temperature/time dependent constitutive rela...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Suhling, J.C., Jaeger, R.C., Lall, P., Rahim, M.K., Roberts, J.C., Hussain, S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aging Assembly Electronic packaging thermal management Electronics packaging Flip chip Sensor arrays Stress measurement Temperature sensors Testing Thermal stresses
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