Relation between yield and reliability of integrated circuits: experimental results and application to continuous early failure rate reduction programs

The relation between yield and early failures as encountered in the field was investigated with several high volume IC's manufactured in several processes. A clear correlation between yield and reliability was found that obeys a simple model. The model also provides the ability to predict the F...

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Hauptverfasser: Kuper, F., van der Pol, J., Ooms, E., Johnson, T., Wijburg, R., Koster, W., Johnston, D.
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container_start_page 17
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creator Kuper, F.
van der Pol, J.
Ooms, E.
Johnson, T.
Wijburg, R.
Koster, W.
Johnston, D.
description The relation between yield and early failures as encountered in the field was investigated with several high volume IC's manufactured in several processes. A clear correlation between yield and reliability was found that obeys a simple model. The model also provides the ability to predict the FIT or PPM level of a given IC based on its yield. Using these results we illustrate how a wafer fab may improve the reliability level of its products in a controlled way.
doi_str_mv 10.1109/RELPHY.1996.492055
format Conference Proceeding
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Application specific integrated circuits
Circuit testing
Failure analysis
Integrated circuit modeling
Integrated circuit reliability
Integrated circuit yield
Jacobian matrices
Life testing
Product design
Semiconductor device modeling
title Relation between yield and reliability of integrated circuits: experimental results and application to continuous early failure rate reduction programs
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