The contact stress analysis of the ferrule-hub assembly used in the photonic device packaging

The contact stress analysis of the ferrule-hub assembly used in the photonic device packaging

Fiber-to-the-premise architectures, by their nature, require numerous fiber connections for distribution of services to multiple home and business locations. The higher performance of angle-polished connection (APCs) in the outside plant (OSP) environment has widely used in FTTP network. The APC fer...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: En Lin, S.I., Yu Kai Chen
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Assembly
Business
Connectors
Contacts
Optical devices
Optical fiber devices
Optical fiber networks
Packaging
Stress
Transceivers
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 75
container_issue
container_start_page 72
container_title
container_volume
creator En Lin, S.I.
Yu Kai Chen
description Fiber-to-the-premise architectures, by their nature, require numerous fiber connections for distribution of services to multiple home and business locations. The higher performance of angle-polished connection (APCs) in the outside plant (OSP) environment has widely used in FTTP network. The APC ferrule-hub assembly is an essential part in the device components, such as connectors and transceivers in the optical network. The defect modes in such ferrule-hub include epoxy leakage, contact surface crack, ferrule drop out, which result in device failure and optical signal disconnection. In this study, we first investigated on ferrule stress distribution which caused by the hub design and interference tolerance. The commercial available MSC.Marc program was used in this contact stress analysis. We further demonstrate that fixture and hub designs, apply force velocity and ferrule geometric imperfection can greatly alter the contact stress in the ferrule tip. Such optimal parameters were integrated into our automatic machine to show the good agreement between theoretical study and experimental work.
doi_str_mv 10.1109/EMAP.2008.4784232
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4784232</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4784232</ieee_id><sourcerecordid>4784232</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-7b59b7ca1843993d9727c4b56b9e967a5eb5c2e03129ebb558a694424689523a3</originalsourceid><addsrcrecordid>eNo1UF9LwzAcjIigzn4A8SVfoDN_m-RxjOmEiT70VUaS_rpGu3Y0qdBvb9H5dBx3HHeH0D0lS0qJedy8rt6XjBC9FEoLxtkFuqWCCcELRsUlyozS_5yQa5TF-EkIoaZQlOob9FE2gH3fJesTjmmAGLHtbDvFEHFf4zTLNQzD2ELejA7bGOHo2gmPESocul_DqelT3wWPK_gOfubWf9lD6A536Kq2bYTsjAtUPm3K9TbfvT2_rFe7PBiScuWkccpbqgU3hldGMeWFk4UzMPe0Epz0DAinzIBzUmpbGDGPKrSRjFu-QA9_sQEA9qchHO0w7c-H8B_TRlQb</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>The contact stress analysis of the ferrule-hub assembly used in the photonic device packaging</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>En Lin, S.I. ; Yu Kai Chen</creator><creatorcontrib>En Lin, S.I. ; Yu Kai Chen</creatorcontrib><description>Fiber-to-the-premise architectures, by their nature, require numerous fiber connections for distribution of services to multiple home and business locations. The higher performance of angle-polished connection (APCs) in the outside plant (OSP) environment has widely used in FTTP network. The APC ferrule-hub assembly is an essential part in the device components, such as connectors and transceivers in the optical network. The defect modes in such ferrule-hub include epoxy leakage, contact surface crack, ferrule drop out, which result in device failure and optical signal disconnection. In this study, we first investigated on ferrule stress distribution which caused by the hub design and interference tolerance. The commercial available MSC.Marc program was used in this contact stress analysis. We further demonstrate that fixture and hub designs, apply force velocity and ferrule geometric imperfection can greatly alter the contact stress in the ferrule tip. Such optimal parameters were integrated into our automatic machine to show the good agreement between theoretical study and experimental work.</description><identifier>ISBN: 9781424436200</identifier><identifier>ISBN: 1424436206</identifier><identifier>EISBN: 1424436214</identifier><identifier>EISBN: 9781424436217</identifier><identifier>DOI: 10.1109/EMAP.2008.4784232</identifier><language>eng</language><publisher>IEEE</publisher><subject>Assembly ; Business ; Connectors ; Contacts ; Optical devices ; Optical fiber devices ; Optical fiber networks ; Packaging ; Stress ; Transceivers</subject><ispartof>2008 International Conference on Electronic Materials and Packaging, 2008, p.72-75</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4784232$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2051,27904,54899</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4784232$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>En Lin, S.I.</creatorcontrib><creatorcontrib>Yu Kai Chen</creatorcontrib><title>The contact stress analysis of the ferrule-hub assembly used in the photonic device packaging</title><title>2008 International Conference on Electronic Materials and Packaging</title><addtitle>EMAP</addtitle><description>Fiber-to-the-premise architectures, by their nature, require numerous fiber connections for distribution of services to multiple home and business locations. The higher performance of angle-polished connection (APCs) in the outside plant (OSP) environment has widely used in FTTP network. The APC ferrule-hub assembly is an essential part in the device components, such as connectors and transceivers in the optical network. The defect modes in such ferrule-hub include epoxy leakage, contact surface crack, ferrule drop out, which result in device failure and optical signal disconnection. In this study, we first investigated on ferrule stress distribution which caused by the hub design and interference tolerance. The commercial available MSC.Marc program was used in this contact stress analysis. We further demonstrate that fixture and hub designs, apply force velocity and ferrule geometric imperfection can greatly alter the contact stress in the ferrule tip. Such optimal parameters were integrated into our automatic machine to show the good agreement between theoretical study and experimental work.</description><subject>Assembly</subject><subject>Business</subject><subject>Connectors</subject><subject>Contacts</subject><subject>Optical devices</subject><subject>Optical fiber devices</subject><subject>Optical fiber networks</subject><subject>Packaging</subject><subject>Stress</subject><subject>Transceivers</subject><isbn>9781424436200</isbn><isbn>1424436206</isbn><isbn>1424436214</isbn><isbn>9781424436217</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1UF9LwzAcjIigzn4A8SVfoDN_m-RxjOmEiT70VUaS_rpGu3Y0qdBvb9H5dBx3HHeH0D0lS0qJedy8rt6XjBC9FEoLxtkFuqWCCcELRsUlyozS_5yQa5TF-EkIoaZQlOob9FE2gH3fJesTjmmAGLHtbDvFEHFf4zTLNQzD2ELejA7bGOHo2gmPESocul_DqelT3wWPK_gOfubWf9lD6A536Kq2bYTsjAtUPm3K9TbfvT2_rFe7PBiScuWkccpbqgU3hldGMeWFk4UzMPe0Epz0DAinzIBzUmpbGDGPKrSRjFu-QA9_sQEA9qchHO0w7c-H8B_TRlQb</recordid><startdate>200810</startdate><enddate>200810</enddate><creator>En Lin, S.I.</creator><creator>Yu Kai Chen</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200810</creationdate><title>The contact stress analysis of the ferrule-hub assembly used in the photonic device packaging</title><author>En Lin, S.I. ; Yu Kai Chen</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-7b59b7ca1843993d9727c4b56b9e967a5eb5c2e03129ebb558a694424689523a3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Assembly</topic><topic>Business</topic><topic>Connectors</topic><topic>Contacts</topic><topic>Optical devices</topic><topic>Optical fiber devices</topic><topic>Optical fiber networks</topic><topic>Packaging</topic><topic>Stress</topic><topic>Transceivers</topic><toplevel>online_resources</toplevel><creatorcontrib>En Lin, S.I.</creatorcontrib><creatorcontrib>Yu Kai Chen</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>En Lin, S.I.</au><au>Yu Kai Chen</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The contact stress analysis of the ferrule-hub assembly used in the photonic device packaging</atitle><btitle>2008 International Conference on Electronic Materials and Packaging</btitle><stitle>EMAP</stitle><date>2008-10</date><risdate>2008</risdate><spage>72</spage><epage>75</epage><pages>72-75</pages><isbn>9781424436200</isbn><isbn>1424436206</isbn><eisbn>1424436214</eisbn><eisbn>9781424436217</eisbn><abstract>Fiber-to-the-premise architectures, by their nature, require numerous fiber connections for distribution of services to multiple home and business locations. The higher performance of angle-polished connection (APCs) in the outside plant (OSP) environment has widely used in FTTP network. The APC ferrule-hub assembly is an essential part in the device components, such as connectors and transceivers in the optical network. The defect modes in such ferrule-hub include epoxy leakage, contact surface crack, ferrule drop out, which result in device failure and optical signal disconnection. In this study, we first investigated on ferrule stress distribution which caused by the hub design and interference tolerance. The commercial available MSC.Marc program was used in this contact stress analysis. We further demonstrate that fixture and hub designs, apply force velocity and ferrule geometric imperfection can greatly alter the contact stress in the ferrule tip. Such optimal parameters were integrated into our automatic machine to show the good agreement between theoretical study and experimental work.</abstract><pub>IEEE</pub><doi>10.1109/EMAP.2008.4784232</doi><tpages>4</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISBN: 9781424436200
ispartof 2008 International Conference on Electronic Materials and Packaging, 2008, p.72-75
issn
language eng
recordid cdi_ieee_primary_4784232
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Assembly
Business
Connectors
Contacts
Optical devices
Optical fiber devices
Optical fiber networks
Packaging
Stress
Transceivers
title The contact stress analysis of the ferrule-hub assembly used in the photonic device packaging
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T06%3A00%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=The%20contact%20stress%20analysis%20of%20the%20ferrule-hub%20assembly%20used%20in%20the%20photonic%20device%20packaging&rft.btitle=2008%20International%20Conference%20on%20Electronic%20Materials%20and%20Packaging&rft.au=En%20Lin,%20S.I.&rft.date=2008-10&rft.spage=72&rft.epage=75&rft.pages=72-75&rft.isbn=9781424436200&rft.isbn_list=1424436206&rft_id=info:doi/10.1109/EMAP.2008.4784232&rft_dat=%3Cieee_6IE%3E4784232%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424436214&rft.eisbn_list=9781424436217&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4784232&rfr_iscdi=true