SiP Embedded Technology in 12 inch Format

SiP technology has been one of the alternative solutions to system integration. Compare to SoC, SiP has the advantages of integration of dies made from different technologies, e.g. GaAs and Silicon. In some cases, SiP technology may provide faster time to the market and at a lower cost. Despite many...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Dyi-Chung Hu, Tsung Jen Yang, Ferry Hu
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Costs Electronics packaging Gallium arsenide Mass production Metallization Silicon Substrates Surface reconstruction Wafer bonding Wafer scale integration
Online-Zugang:	Volltext bestellen
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