Reliability Characterization of Ni-based Microinsert Interconnections for Flip Chip Die on Wafer Attachment and Their Evaluation in Multichip SIMCARD Prototype
Face to face interconnection is an important technology for the assembly of heterogeneously integrated systems; it permits the integration of technologies from disparate backgrounds and allows separate technology optimization prior to assembly. This paper reports work on the optimization of micro-in...
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| creator | Boutry, H. Souriau, J.-C. Brun, J. Franiatte, R. Nowodzinski, A. Sillon, N. Dubois-Bonvalot, B. Depoutot, F. Brunet, O. Peytavy, A. |
| description | Face to face interconnection is an important technology for the assembly of heterogeneously integrated systems; it permits the integration of technologies from disparate backgrounds and allows separate technology optimization prior to assembly. This paper reports work on the optimization of micro-insert technology, which allows the electrical connection between the two systems. SimCard Prototypes have been developed and evaluated in usual and moisture conditions.Thermal cycling of test structures between -40°C and + 85°C has been performed at wafer level and results indicate that the average resistance of the daisy chain observed between the two devices does not change. However, electrical yield of the structures under damping tests @85°C and 85% of humidity decrease significantly as a consequence of the glue degradation. However further damping tests have been realized on the final packaged cards without any deterioration of the prototype. |
| doi_str_mv | 10.1109/EPTC.2008.4763616 |
| format | Conference Proceeding |
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This paper reports work on the optimization of micro-insert technology, which allows the electrical connection between the two systems. SimCard Prototypes have been developed and evaluated in usual and moisture conditions.Thermal cycling of test structures between -40°C and + 85°C has been performed at wafer level and results indicate that the average resistance of the daisy chain observed between the two devices does not change. However, electrical yield of the structures under damping tests @85°C and 85% of humidity decrease significantly as a consequence of the glue degradation. 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This paper reports work on the optimization of micro-insert technology, which allows the electrical connection between the two systems. SimCard Prototypes have been developed and evaluated in usual and moisture conditions.Thermal cycling of test structures between -40°C and + 85°C has been performed at wafer level and results indicate that the average resistance of the daisy chain observed between the two devices does not change. However, electrical yield of the structures under damping tests @85°C and 85% of humidity decrease significantly as a consequence of the glue degradation. However further damping tests have been realized on the final packaged cards without any deterioration of the prototype.</description><subject>Assembly systems</subject><subject>Damping</subject><subject>Degradation</subject><subject>Electric resistance</subject><subject>Flip chip</subject><subject>Humidity</subject><subject>Moisture</subject><subject>Performance evaluation</subject><subject>Prototypes</subject><subject>Testing</subject><isbn>9781424421176</isbn><isbn>1424421179</isbn><isbn>1424421187</isbn><isbn>9781424421183</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1kNFOwjAUhmsMiYI8gPGmLzBs167tLskAJQEliPGSdN1pqBkd6YoJvoyv6gh6Ls6fk3z__ycHoXtKRpSS_HG62hSjlBA14lIwQcUV6lOecp5SquQ1GuZS_d9S9FD_zOaECJneoGHbfpJueMZUym7Rzxpqp0tXu3jCxU4HbSIE962jazxuLH5xSalbqPDSmdA430KIeO47yDTegzlzLbZNwLPaHbqIbk0c4M79oS0EPI5Rm90efMTaV3izAxfw9EvXx0uH83h5rKMzZ-fbfFmM1xO8Ck1s4ukAd6hndd3C8E8H6H023RTPyeL1aV6MF4mjJIuJSEUuuTVKGlLyTJfGlrnMK2WVrYzKhLA2M4pRA9KAZhxsxiipUsuI0bxkA_RwyXUAsD0Et9fhtP17MPsF2sxv7Q</recordid><startdate>200812</startdate><enddate>200812</enddate><creator>Boutry, H.</creator><creator>Souriau, J.-C.</creator><creator>Brun, J.</creator><creator>Franiatte, R.</creator><creator>Nowodzinski, A.</creator><creator>Sillon, N.</creator><creator>Dubois-Bonvalot, B.</creator><creator>Depoutot, F.</creator><creator>Brunet, O.</creator><creator>Peytavy, A.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200812</creationdate><title>Reliability Characterization of Ni-based Microinsert Interconnections for Flip Chip Die on Wafer Attachment and Their Evaluation in Multichip SIMCARD Prototype</title><author>Boutry, H. ; Souriau, J.-C. ; Brun, J. ; Franiatte, R. ; Nowodzinski, A. ; Sillon, N. ; Dubois-Bonvalot, B. ; Depoutot, F. ; Brunet, O. ; Peytavy, A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i105t-626974fc87c0b45abcfb979d8f8fdc8566ff5c831ce7cea34ef5310d2f30ca4b3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Assembly systems</topic><topic>Damping</topic><topic>Degradation</topic><topic>Electric resistance</topic><topic>Flip chip</topic><topic>Humidity</topic><topic>Moisture</topic><topic>Performance evaluation</topic><topic>Prototypes</topic><topic>Testing</topic><toplevel>online_resources</toplevel><creatorcontrib>Boutry, H.</creatorcontrib><creatorcontrib>Souriau, J.-C.</creatorcontrib><creatorcontrib>Brun, J.</creatorcontrib><creatorcontrib>Franiatte, R.</creatorcontrib><creatorcontrib>Nowodzinski, A.</creatorcontrib><creatorcontrib>Sillon, N.</creatorcontrib><creatorcontrib>Dubois-Bonvalot, B.</creatorcontrib><creatorcontrib>Depoutot, F.</creatorcontrib><creatorcontrib>Brunet, O.</creatorcontrib><creatorcontrib>Peytavy, A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Boutry, H.</au><au>Souriau, J.-C.</au><au>Brun, J.</au><au>Franiatte, R.</au><au>Nowodzinski, A.</au><au>Sillon, N.</au><au>Dubois-Bonvalot, B.</au><au>Depoutot, F.</au><au>Brunet, O.</au><au>Peytavy, A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Reliability Characterization of Ni-based Microinsert Interconnections for Flip Chip Die on Wafer Attachment and Their Evaluation in Multichip SIMCARD Prototype</atitle><btitle>2008 10th Electronics Packaging Technology Conference</btitle><stitle>EPTC</stitle><date>2008-12</date><risdate>2008</risdate><spage>1334</spage><epage>1339</epage><pages>1334-1339</pages><isbn>9781424421176</isbn><isbn>1424421179</isbn><eisbn>1424421187</eisbn><eisbn>9781424421183</eisbn><abstract>Face to face interconnection is an important technology for the assembly of heterogeneously integrated systems; it permits the integration of technologies from disparate backgrounds and allows separate technology optimization prior to assembly. This paper reports work on the optimization of micro-insert technology, which allows the electrical connection between the two systems. SimCard Prototypes have been developed and evaluated in usual and moisture conditions.Thermal cycling of test structures between -40°C and + 85°C has been performed at wafer level and results indicate that the average resistance of the daisy chain observed between the two devices does not change. However, electrical yield of the structures under damping tests @85°C and 85% of humidity decrease significantly as a consequence of the glue degradation. However further damping tests have been realized on the final packaged cards without any deterioration of the prototype.</abstract><pub>IEEE</pub><doi>10.1109/EPTC.2008.4763616</doi><tpages>6</tpages></addata></record> |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Assembly systems Damping Degradation Electric resistance Flip chip Humidity Moisture Performance evaluation Prototypes Testing |
| title | Reliability Characterization of Ni-based Microinsert Interconnections for Flip Chip Die on Wafer Attachment and Their Evaluation in Multichip SIMCARD Prototype |
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