Impact of the CMP Process on the Multilevel Stack Mechanical Reliability

The Chemical-Mechanical Polishing (CMP) process is still challenging for the semiconductor industry: during this key step, decohesion/adhesion fracture often occurs. The authors have developed a specific methodology in order to estimate this potential risk. This methodology uses finite element simul...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Moreau, S., Barbe, J.-C., Leduc, P., Maitrejean, S., Passemard, G.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adhesives Chemical industry Chemical Mechanical Polishing (CMP) Chemical processes Copper Delamination Dielectrics Electronics industry Finite element methods Finite Element simulation Planarization Residual stresses Virtual Crack Closure Technique (VCCT)
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!