New Approach for Wafer Level Crystal Unit Package

The new packaging approach for crystal resonator with quartz crystal is described in this paper. We designed and optimized the structure of wafer level crystal unit package for low cost and high performance with 2.0×1.6×0.45 mm 3 size. The crystal unit package is reduced in size and thickness by usi...

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Hauptverfasser: Tae Hoon Kim, Jong Yeol Jeon, Yun Pyo Kwak, Ju Pyo Hong, Tae Ho Kim, Eun Jung Lim, Jang Ho Park, Seog Moon Choi, Sung Yi
Format: Tagungsbericht
Sprache:eng
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