Applied optimization of black oxide flat heat spreader for low-k molded flip chip packages

The most important factor associated with cracking phenomenon during reflow soldering and molding are delamination at the interface of component material of packages. Copper has been widely used as substrate and leadframe as it has good thermal performance. However, Copper surface exposed to environ...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chun-An Huang, Hui Ming Huang, Ho-Yi Tsai, Chiu, S., Huang, C.M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Coatings Copper Delamination Flip chip Lead Packaging Polymers Reflow soldering Surface cracks
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