Processing and characterization of precision microparts from nickel-based materials
The objective of this research was to study the influence of electroplating parameters on electrodeposit characteristics for the production of nickel (Ni) and nickel-iron (Ni-Fe) microparts by photoelectroforming. The research focused on the most relevant parameter for industry, which is the current...
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| creator | Allen, D.M. Almond, H.J. Bedner, K. Cabeza, M. Courtot, B. Duval, A. Impey, S.A. Saumer, M. |
| description | The objective of this research was to study the influence of electroplating parameters on electrodeposit characteristics for the production of nickel (Ni) and nickel-iron (Ni-Fe) microparts by photoelectroforming. The research focused on the most relevant parameter for industry, which is the current density, because it determines the process time and the consumed energy. The results of the Ni and Ni-Fe characterisations can be divided into two aspects closely linked with each other; the morphology and the hardness. |
| doi_str_mv | 10.1109/DTIP.2008.4753013 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>pascalfrancis_6IE</sourceid><recordid>TN_cdi_ieee_primary_4753013</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4753013</ieee_id><sourcerecordid>20508041</sourcerecordid><originalsourceid>FETCH-LOGICAL-i248t-d184e0f41a97745946d8692600826b3cc2965c130ec27ee565111db5e72481723</originalsourceid><addsrcrecordid>eNo9UE1LAzEUDIig1v4A8ZKLx13z8rk5StVaKFiwnks2-1aj3Q-SveivN6XFd5n3mJnHMITcACsBmL1_3K42JWesKqVRgoE4I1dcKMXyaHtB5il95RWsNqDFJXnbxMFjSqH_oK5vqP900fkJY_h1Uxh6OrR0jOhDOhxd8HEYXZwSbePQ0T74b9wXtUvY0M4dbG6frsl5mwHnJ5yR9-en7eKlWL8uV4uHdRG4rKaigUoiayU4a4xUVuqm0pbrHJ7rWnjPrVYeBEPPDaLSCgCaWqHJdjBczMjd8e_oknf7Nro-59yNMXQu_uw4U6xiErLu9qgLiPhPn_oRfxYtWsE</addsrcrecordid><sourcetype>Index Database</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Processing and characterization of precision microparts from nickel-based materials</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Allen, D.M. ; Almond, H.J. ; Bedner, K. ; Cabeza, M. ; Courtot, B. ; Duval, A. ; Impey, S.A. ; Saumer, M.</creator><creatorcontrib>Allen, D.M. ; Almond, H.J. ; Bedner, K. ; Cabeza, M. ; Courtot, B. ; Duval, A. ; Impey, S.A. ; Saumer, M.</creatorcontrib><description>The objective of this research was to study the influence of electroplating parameters on electrodeposit characteristics for the production of nickel (Ni) and nickel-iron (Ni-Fe) microparts by photoelectroforming. The research focused on the most relevant parameter for industry, which is the current density, because it determines the process time and the consumed energy. The results of the Ni and Ni-Fe characterisations can be divided into two aspects closely linked with each other; the morphology and the hardness.</description><identifier>ISBN: 2355000069</identifier><identifier>ISBN: 9782355000065</identifier><identifier>DOI: 10.1109/DTIP.2008.4753013</identifier><language>eng</language><publisher>Grenoble: IEEE</publisher><subject>Applied sciences ; Conducting materials ; Current density ; Electronics ; Exact sciences and technology ; Gas insulated transmission lines ; Grain size ; Iron ; Microelectronic fabrication (materials and surfaces technology) ; Nickel ; Resists ; Scanning electron microscopy ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Silicon ; Surface morphology</subject><ispartof>2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008, p.335-338</ispartof><rights>2008 INIST-CNRS</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4753013$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,4036,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4753013$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=20508041$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Allen, D.M.</creatorcontrib><creatorcontrib>Almond, H.J.</creatorcontrib><creatorcontrib>Bedner, K.</creatorcontrib><creatorcontrib>Cabeza, M.</creatorcontrib><creatorcontrib>Courtot, B.</creatorcontrib><creatorcontrib>Duval, A.</creatorcontrib><creatorcontrib>Impey, S.A.</creatorcontrib><creatorcontrib>Saumer, M.</creatorcontrib><title>Processing and characterization of precision microparts from nickel-based materials</title><title>2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS</title><addtitle>DTIP</addtitle><description>The objective of this research was to study the influence of electroplating parameters on electrodeposit characteristics for the production of nickel (Ni) and nickel-iron (Ni-Fe) microparts by photoelectroforming. The research focused on the most relevant parameter for industry, which is the current density, because it determines the process time and the consumed energy. The results of the Ni and Ni-Fe characterisations can be divided into two aspects closely linked with each other; the morphology and the hardness.</description><subject>Applied sciences</subject><subject>Conducting materials</subject><subject>Current density</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Gas insulated transmission lines</subject><subject>Grain size</subject><subject>Iron</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Nickel</subject><subject>Resists</subject><subject>Scanning electron microscopy</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Silicon</subject><subject>Surface morphology</subject><isbn>2355000069</isbn><isbn>9782355000065</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo9UE1LAzEUDIig1v4A8ZKLx13z8rk5StVaKFiwnks2-1aj3Q-SveivN6XFd5n3mJnHMITcACsBmL1_3K42JWesKqVRgoE4I1dcKMXyaHtB5il95RWsNqDFJXnbxMFjSqH_oK5vqP900fkJY_h1Uxh6OrR0jOhDOhxd8HEYXZwSbePQ0T74b9wXtUvY0M4dbG6frsl5mwHnJ5yR9-en7eKlWL8uV4uHdRG4rKaigUoiayU4a4xUVuqm0pbrHJ7rWnjPrVYeBEPPDaLSCgCaWqHJdjBczMjd8e_oknf7Nro-59yNMXQu_uw4U6xiErLu9qgLiPhPn_oRfxYtWsE</recordid><startdate>200804</startdate><enddate>200804</enddate><creator>Allen, D.M.</creator><creator>Almond, H.J.</creator><creator>Bedner, K.</creator><creator>Cabeza, M.</creator><creator>Courtot, B.</creator><creator>Duval, A.</creator><creator>Impey, S.A.</creator><creator>Saumer, M.</creator><general>IEEE</general><general>EDA publishing</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope><scope>IQODW</scope></search><sort><creationdate>200804</creationdate><title>Processing and characterization of precision microparts from nickel-based materials</title><author>Allen, D.M. ; Almond, H.J. ; Bedner, K. ; Cabeza, M. ; Courtot, B. ; Duval, A. ; Impey, S.A. ; Saumer, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i248t-d184e0f41a97745946d8692600826b3cc2965c130ec27ee565111db5e72481723</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Applied sciences</topic><topic>Conducting materials</topic><topic>Current density</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Gas insulated transmission lines</topic><topic>Grain size</topic><topic>Iron</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Nickel</topic><topic>Resists</topic><topic>Scanning electron microscopy</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Silicon</topic><topic>Surface morphology</topic><toplevel>online_resources</toplevel><creatorcontrib>Allen, D.M.</creatorcontrib><creatorcontrib>Almond, H.J.</creatorcontrib><creatorcontrib>Bedner, K.</creatorcontrib><creatorcontrib>Cabeza, M.</creatorcontrib><creatorcontrib>Courtot, B.</creatorcontrib><creatorcontrib>Duval, A.</creatorcontrib><creatorcontrib>Impey, S.A.</creatorcontrib><creatorcontrib>Saumer, M.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection><collection>Pascal-Francis</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Allen, D.M.</au><au>Almond, H.J.</au><au>Bedner, K.</au><au>Cabeza, M.</au><au>Courtot, B.</au><au>Duval, A.</au><au>Impey, S.A.</au><au>Saumer, M.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Processing and characterization of precision microparts from nickel-based materials</atitle><btitle>2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS</btitle><stitle>DTIP</stitle><date>2008-04</date><risdate>2008</risdate><spage>335</spage><epage>338</epage><pages>335-338</pages><isbn>2355000069</isbn><isbn>9782355000065</isbn><abstract>The objective of this research was to study the influence of electroplating parameters on electrodeposit characteristics for the production of nickel (Ni) and nickel-iron (Ni-Fe) microparts by photoelectroforming. The research focused on the most relevant parameter for industry, which is the current density, because it determines the process time and the consumed energy. The results of the Ni and Ni-Fe characterisations can be divided into two aspects closely linked with each other; the morphology and the hardness.</abstract><cop>Grenoble</cop><pub>IEEE</pub><doi>10.1109/DTIP.2008.4753013</doi><tpages>4</tpages><oa>free_for_read</oa></addata></record> |
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| identifier | ISBN: 2355000069 |
| ispartof | 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008, p.335-338 |
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| language | eng |
| recordid | cdi_ieee_primary_4753013 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Applied sciences Conducting materials Current density Electronics Exact sciences and technology Gas insulated transmission lines Grain size Iron Microelectronic fabrication (materials and surfaces technology) Nickel Resists Scanning electron microscopy Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon Surface morphology |
| title | Processing and characterization of precision microparts from nickel-based materials |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T19%3A19%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Processing%20and%20characterization%20of%20precision%20microparts%20from%20nickel-based%20materials&rft.btitle=2008%20Symposium%20on%20Design,%20Test,%20Integration%20and%20Packaging%20of%20MEMS/MOEMS&rft.au=Allen,%20D.M.&rft.date=2008-04&rft.spage=335&rft.epage=338&rft.pages=335-338&rft.isbn=2355000069&rft.isbn_list=9782355000065&rft_id=info:doi/10.1109/DTIP.2008.4753013&rft_dat=%3Cpascalfrancis_6IE%3E20508041%3C/pascalfrancis_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4753013&rfr_iscdi=true |