A low-cost through via interconnection for ISM WLP

WLP (Wafer level packaging) for image sensor device has the advantage of small size, high performance and low cost. In WLP technology, in order to establish electrical interconnection from image sensor contact pad to the backside of the wafer, several structures have been developed, such as T-contac...

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Bibliographische Detailangaben
Hauptverfasser:	JINGLI YUAN, JEUNG, Won-Kyu, LIM, Chang-Hyun, PARK, Seung-Wook, KWEON, Young-Do, YI, Sung
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Contacts Costs Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Fabrication Fundamental areas of phenomenology (including applications) Glass Image sensors Imaging detectors and sensors Imaging devices Integrated circuits Microelectronic fabrication (materials and surfaces technology) Optical elements, devices, and systems Optics Packaging Physics Protection Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon Through-silicon vias Wafer scale integration
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