High performance 3.3- and 5-V 0.5-/spl mu/m CMOS technology for ASIC's

Process integration of two manufacturable high performance 0.5-/spl mu/m CMOS technologies, one optimized for 5.0 V operation and the second optimized for 3.3-V operation, will be presented. The paper will emphasize poly-buffered LOGOS (PBL) isolation, MOS transistor design using conventional and st...

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Veröffentlicht in:IEEE transactions on semiconductor manufacturing 1995-11, Vol.8 (4), p.440-448
Hauptverfasser: Kizilyalli, I.C., Thoma, M.J., Lytle, S.A., Martin, E.P., Singh, R., Vitkavage, S.C., Bechtold, P.F., Kearney, J.W., Rambaud, M.M., Twiford, M.S., Cochran, W.T., Fenstermaker, L.R., Freyman, R., Weishi Sun, Duncan, A.
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Sprache:eng
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Zusammenfassung:Process integration of two manufacturable high performance 0.5-/spl mu/m CMOS technologies, one optimized for 5.0 V operation and the second optimized for 3.3-V operation, will be presented. The paper will emphasize poly-buffered LOGOS (PBL) isolation, MOS transistor design using conventional and statistical modeling to reduce circuit performance sensitivity to process fluctuations, gate oxide and gate length control, and hot carrier reliability of the transistors. Manufacturing and simulation data for both 3.3- and 5.0-V technologies will be shown. The nominal ring oscillator delay is measured for both 3.3- and 5.0-V technologies as 80 ps. Therefore, 5.0-V technology equivalent speed is achieved in the 3.3-V technology with a reduction in power consumption by a factor of 2.4.< >
ISSN:0894-6507
1558-2345
DOI:10.1109/66.475186