De-embedding technique for S-parameter measurements under high RF power, coupled to thermal imaging
This work deals with a method for determining accurately reflection coefficient of one-port devices submitted to high RF power. A de-embedding theory based on S-matrix is carried out for mismatches of the test setup components: power amplifier, power circulator and probe. This bench was designed for...
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creator | Ivira, B. Ndagijimana, F. Fillit, R.Y. |
description | This work deals with a method for determining accurately reflection coefficient of one-port devices submitted to high RF power. A de-embedding theory based on S-matrix is carried out for mismatches of the test setup components: power amplifier, power circulator and probe. This bench was designed for reliability issues of RF components. An example of bench application on the new bulk acoustic wave resonator is presented. Those components are now widely used to build RF-filters in wireless-telecommunication systems. Moreover, an infrared camera with high spatial resolution (2 ¿m/pixel) gives complementary information about the temperature induced by self-heating inside probe and device, and its dependence on the RF power. |
doi_str_mv | 10.1109/ARFTG.2006.4734356 |
format | Conference Proceeding |
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A de-embedding theory based on S-matrix is carried out for mismatches of the test setup components: power amplifier, power circulator and probe. This bench was designed for reliability issues of RF components. An example of bench application on the new bulk acoustic wave resonator is presented. Those components are now widely used to build RF-filters in wireless-telecommunication systems. Moreover, an infrared camera with high spatial resolution (2 ¿m/pixel) gives complementary information about the temperature induced by self-heating inside probe and device, and its dependence on the RF power.</description><subject>Acoustic testing</subject><subject>Acoustic waves</subject><subject>Power amplifiers</subject><subject>Power measurement</subject><subject>Power system reliability</subject><subject>Probes</subject><subject>Radio frequency</subject><subject>Radiofrequency amplifiers</subject><subject>Reflection</subject><subject>Scattering parameters</subject><isbn>0780395298</isbn><isbn>9780780395299</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotUM1Kw0AYXJCCtvYF9LIPYOJu9v9Yqq1CQaj1XDa73yaR_LlJEN--ATuXgRmYGQahB0pSSol53hx3p32aESJTrhhnQt6gJVGaMCMyoxdoOXvCMEaJvkXrYfgmM7igVGZ3yL1AAk0O3ldtgUdwZVv9TIBDF_Fn0ttoGxgh4gbsMEVooB0HPLV-lsqqKPFxh_vuF-ITdt3U1-Dx2OGxhNjYGleNLebYe7QIth5gfeUV-tq9nrZvyeFj_77dHJKKKjEmgSlCMy6dk1pzHwQ3jHAQwnOWc5UHrbwDKazVdB6fa2M4yanU3mU06MBW6PE_twKAcx_n-vh3vp7CLt8VVjQ</recordid><startdate>200606</startdate><enddate>200606</enddate><creator>Ivira, B.</creator><creator>Ndagijimana, F.</creator><creator>Fillit, R.Y.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200606</creationdate><title>De-embedding technique for S-parameter measurements under high RF power, coupled to thermal imaging</title><author>Ivira, B. ; Ndagijimana, F. ; Fillit, R.Y.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-f3701246cc6884df549304e55d43b47bf87dce65aa81116b89940b168dc21f8f3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Acoustic testing</topic><topic>Acoustic waves</topic><topic>Power amplifiers</topic><topic>Power measurement</topic><topic>Power system reliability</topic><topic>Probes</topic><topic>Radio frequency</topic><topic>Radiofrequency amplifiers</topic><topic>Reflection</topic><topic>Scattering parameters</topic><toplevel>online_resources</toplevel><creatorcontrib>Ivira, B.</creatorcontrib><creatorcontrib>Ndagijimana, F.</creatorcontrib><creatorcontrib>Fillit, R.Y.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ivira, B.</au><au>Ndagijimana, F.</au><au>Fillit, R.Y.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>De-embedding technique for S-parameter measurements under high RF power, coupled to thermal imaging</atitle><btitle>2006 67th ARFTG Conference</btitle><stitle>ARFTG</stitle><date>2006-06</date><risdate>2006</risdate><spage>121</spage><epage>128</epage><pages>121-128</pages><isbn>0780395298</isbn><isbn>9780780395299</isbn><abstract>This work deals with a method for determining accurately reflection coefficient of one-port devices submitted to high RF power. A de-embedding theory based on S-matrix is carried out for mismatches of the test setup components: power amplifier, power circulator and probe. This bench was designed for reliability issues of RF components. An example of bench application on the new bulk acoustic wave resonator is presented. Those components are now widely used to build RF-filters in wireless-telecommunication systems. Moreover, an infrared camera with high spatial resolution (2 ¿m/pixel) gives complementary information about the temperature induced by self-heating inside probe and device, and its dependence on the RF power.</abstract><pub>IEEE</pub><doi>10.1109/ARFTG.2006.4734356</doi><tpages>8</tpages></addata></record> |
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subjects | Acoustic testing Acoustic waves Power amplifiers Power measurement Power system reliability Probes Radio frequency Radiofrequency amplifiers Reflection Scattering parameters |
title | De-embedding technique for S-parameter measurements under high RF power, coupled to thermal imaging |
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