Study on DHP temperature effect in PSPI exposure process

PSPI has been applied to the end-fab process for better efficiency. However, it causes process time to increase, which can be a serious problem in the photo process. Excessive exposure time results in lower efficiency and lower productivity as well. It is also blamed for a damage of expensive equipm...

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Hauptverfasser:	Doyoung Kim, Kyungsoo Song, Chankyung Kim, Sieung Lee
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Chip scale packaging Circuits Coatings DH-HEMTs DHP(dehydration hot plate) exposure time Lenses Polyimides Productivity PSPI(photo sensitive polyimide) Semiconductor materials Temperature control Temperature distribution
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creator	Doyoung Kim Kyungsoo Song Chankyung Kim Sieung Lee
description	PSPI has been applied to the end-fab process for better efficiency. However, it causes process time to increase, which can be a serious problem in the photo process. Excessive exposure time results in lower efficiency and lower productivity as well. It is also blamed for a damage of expensive equipment lens. Existing countermeasures have yet to clear those problems. As an alternative, DHP temperature control is expected to reduce exposure time by adjusting the hardness of PSPI. Consequently, exposure time per shot can be sharply reduced, enhancing productivity of photo process where many shots are repeatedly exposed to a wafer.
doi_str_mv	10.1109/SMICND.2008.4703354
format	Conference Proceeding
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Consequently, exposure time per shot can be sharply reduced, enhancing productivity of photo process where many shots are repeatedly exposed to a wafer.</description><subject>Chip scale packaging</subject><subject>Circuits</subject><subject>Coatings</subject><subject>DH-HEMTs</subject><subject>DHP(dehydration hot plate)</subject><subject>exposure time</subject><subject>Lenses</subject><subject>Polyimides</subject><subject>Productivity</subject><subject>PSPI(photo sensitive polyimide)</subject><subject>Semiconductor materials</subject><subject>Temperature control</subject><subject>Temperature distribution</subject><issn>1545-827X</issn><issn>2377-0678</issn><isbn>1424420040</isbn><isbn>9781424420049</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotT9tKw0AUXLyAsfYL-rI_kHj2crKbR0m1LVQNRMG3sknOQsQ2IZuC_XtT7MzDwAwzMIwtBCRCQPZYvm7yt2UiAWyiDSiF-opFUhkTQ2rsNbsXWmo95RpuWCRQY2yl-bpj8xC-YYLGcylithyPzYl3B75cF3ykfU-DG48DcfKe6pG3B16UxYbTb9-Fs98PXU0hPLBb734CzS86Y58vzx_5Ot6-rzb50zZuhcExVlpiY5zH1Dkps8ZN9IjaZyI1Kq29B6xT6UFVhLXyBLZB46ECk4GprJqxxf9uS0S7fmj3bjjtLqfVH4K3SL0</recordid><startdate>200810</startdate><enddate>200810</enddate><creator>Doyoung Kim</creator><creator>Kyungsoo Song</creator><creator>Chankyung Kim</creator><creator>Sieung Lee</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200810</creationdate><title>Study on DHP temperature effect in PSPI exposure process</title><author>Doyoung Kim ; Kyungsoo Song ; Chankyung Kim ; Sieung Lee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-3425d7af56aa229dadadf554f916736cff05c62f03be5c3fe08d57f0b07907b83</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Chip scale packaging</topic><topic>Circuits</topic><topic>Coatings</topic><topic>DH-HEMTs</topic><topic>DHP(dehydration hot plate)</topic><topic>exposure time</topic><topic>Lenses</topic><topic>Polyimides</topic><topic>Productivity</topic><topic>PSPI(photo sensitive polyimide)</topic><topic>Semiconductor materials</topic><topic>Temperature control</topic><topic>Temperature distribution</topic><toplevel>online_resources</toplevel><creatorcontrib>Doyoung Kim</creatorcontrib><creatorcontrib>Kyungsoo Song</creatorcontrib><creatorcontrib>Chankyung Kim</creatorcontrib><creatorcontrib>Sieung Lee</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Doyoung Kim</au><au>Kyungsoo Song</au><au>Chankyung Kim</au><au>Sieung Lee</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Study on DHP temperature effect in PSPI exposure process</atitle><btitle>2008 International Semiconductor Conference</btitle><stitle>SMICND</stitle><date>2008-10</date><risdate>2008</risdate><volume>1</volume><spage>151</spage><epage>154</epage><pages>151-154</pages><issn>1545-827X</issn><eissn>2377-0678</eissn><isbn>1424420040</isbn><isbn>9781424420049</isbn><abstract>PSPI has been applied to the end-fab process for better efficiency. However, it causes process time to increase, which can be a serious problem in the photo process. Excessive exposure time results in lower efficiency and lower productivity as well. It is also blamed for a damage of expensive equipment lens. Existing countermeasures have yet to clear those problems. As an alternative, DHP temperature control is expected to reduce exposure time by adjusting the hardness of PSPI. Consequently, exposure time per shot can be sharply reduced, enhancing productivity of photo process where many shots are repeatedly exposed to a wafer.</abstract><pub>IEEE</pub><doi>10.1109/SMICND.2008.4703354</doi><tpages>4</tpages></addata></record>
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source	IEEE Electronic Library (IEL) Conference Proceedings
subjects	Chip scale packaging Circuits Coatings DH-HEMTs DHP(dehydration hot plate) exposure time Lenses Polyimides Productivity PSPI(photo sensitive polyimide) Semiconductor materials Temperature control Temperature distribution
title	Study on DHP temperature effect in PSPI exposure process
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