Stress grading in integrated power modules

Stress grading in integrated power modules

Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level. However, the continuous increase of the voltage lead to questions regarding power device environment. We di...

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Bibliographische Detailangaben
Hauptverfasser: Duchesne, C., Mermet-Guyennet, M., Dutarde, E., Lebey, T., Dagdag, S.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Conductivity
Copper
Electronics packaging
Metallization
Multichip modules
Permittivity
Power electronics
Semiconductor materials
Stress
Voltage
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Beschreibung
Zusammenfassung:Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level. However, the continuous increase of the voltage lead to questions regarding power device environment. We discuss in the following different solutions able to achieve the electric stress gradation.
ISSN:2150-6078
DOI:10.1109/ICPE.2007.4692407