Investigation of thick film electronic packaging materials in dynamic contact with artificial body fluids

Thick film electronic packaging materials based on Ag-Pt (C4729), Ag-Pd (C2030) and Pt (LPA 88-11) conductive pastes were tested on their properties under the influence of flowing artificial blood plasma (ABP), artificial cerebrospinal fluid (ACF) and physiological solution (0.9% NaCl) for the evalu...

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Hauptverfasser: Beshchasna, N., Engelien, E., Uhlemann, J., Wolter, K.-J.
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Engelien, E.
Uhlemann, J.
Wolter, K.-J.
description Thick film electronic packaging materials based on Ag-Pt (C4729), Ag-Pd (C2030) and Pt (LPA 88-11) conductive pastes were tested on their properties under the influence of flowing artificial blood plasma (ABP), artificial cerebrospinal fluid (ACF) and physiological solution (0.9% NaCl) for the evaluation of their biostability grade in vitro. The degradation effects were studied by means of microscopic investigations, measurements of a surface free energy, determination of mass losses and analysis of a chemical content. Materials were stressed in fluid mediums during the periods of up to 60 days at the temperature of 60degC, pH value of (8-10) and flow velocity of 0.15 m/s in systems with a directional flow and by an unidirectional fluid circulation. Based on SEM-EDX analysis, formation of silver sulphide (Ag2S) in form of yellow-brown precipitate has been observed on Ag-Pt surfaces, which were influenced by ABP and ACF; a partly dissolution of Zn and Na particles from pastes glass matrix was supposed. No significant alterations in chemical content were revealed in case of interactions between Ag-Pt thick films and 0.9% NaCl. Ag-Pd surfaces were more stable due to formation of the protection palladium oxide (PdO) film. A very good stability have shown Pt-layers.
doi_str_mv 10.1109/ESTC.2008.4684358
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subjects Biological materials
Blood
Chemical analysis
Conducting materials
Electronic equipment testing
Electronics packaging
Fluid dynamics
Materials testing
Plasma properties
Thick films
title Investigation of thick film electronic packaging materials in dynamic contact with artificial body fluids
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