Variability in 3-D integrated circuits

In recent years, there has been a trend among digital and analog circuit designers towards three-dimensional integration. There has been some debate regarding the applicability of 3-D technology to general logic circuits, especially with regard to thermal issues. We examine process variations on the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Akopyan, F., Otero, C., Fang, D., Jackson, S.J., Manohar, R.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Asynchronous circuits Degradation Delay Integrated circuit interconnections Logic circuits Manufacturing Silicon on insulator technology Temperature Three-dimensional integrated circuits Wire
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