Fast Thermal Models for Power Device Packaging
This paper describes the development and implementation of an analytical thermal model for fast and accurate thermal simulations of power device modules. A Fourier-based solution is used to solve the heat equation in two dimensions. The solution can describe the variation of temperature through the...
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| creator | Swan, I.R. Bryant, A.T. Mawby, P.A. |
| description | This paper describes the development and implementation of an analytical thermal model for fast and accurate thermal simulations of power device modules. A Fourier-based solution is used to solve the heat equation in two dimensions. The solution can describe the variation of temperature through the structure versus time. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink. The model has been validated against FEM simulations and the difference between the two models has been illustrated. The required aspects of heat diffusion are captured successfully by the Fourier-based model. |
| doi_str_mv | 10.1109/08IAS.2008.359 |
| format | Conference Proceeding |
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A Fourier-based solution is used to solve the heat equation in two dimensions. The solution can describe the variation of temperature through the structure versus time. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink. The model has been validated against FEM simulations and the difference between the two models has been illustrated. The required aspects of heat diffusion are captured successfully by the Fourier-based model.</description><subject>Analytical models</subject><subject>Circuit simulation</subject><subject>Computational modeling</subject><subject>Electronic packaging thermal management</subject><subject>Equations</subject><subject>Fourier series</subject><subject>Insulated gate bipolar transistors</subject><subject>Integrated circuit packaging</subject><subject>Mathematical model</subject><subject>Thermal engineering</subject><issn>0197-2618</issn><issn>2576-702X</issn><isbn>9781424422784</isbn><isbn>1424422787</isbn><isbn>9781424422791</isbn><isbn>1424422795</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpVzD1PwzAQgGHzJRFKVxYW_4GEu4t9Po9VoVCpiErtwFY5sVsCKUFJBeLfM8DC9A6P9Cp1hVAggr8BmU9WBQFIUVp_pMbeCRoyhsh5PFYZWce5A3o--WdiTlUG6F1OjHKuLobhFQBKYcxUMQvDQa9fUr8PrX7sYmoHve16vey-Uq9v02dTJ70M9VvYNe-7S3W2De2Qxn8dqdXsbj19yBdP9_PpZJE3Hg65xYBI1RY8lBVxhT6IRBfRheSjc9HbKJwIK2ugZrFSBWZgQ8IEVI7U9e-1SSltPvpmH_rvjWHr0bjyB_9iRIo</recordid><startdate>200810</startdate><enddate>200810</enddate><creator>Swan, I.R.</creator><creator>Bryant, A.T.</creator><creator>Mawby, P.A.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200810</creationdate><title>Fast Thermal Models for Power Device Packaging</title><author>Swan, I.R. ; Bryant, A.T. ; Mawby, P.A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-51a112bf0903b26b19a88d7d17ae9d77d95d86e21b540c6858ba660642862023</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Analytical models</topic><topic>Circuit simulation</topic><topic>Computational modeling</topic><topic>Electronic packaging thermal management</topic><topic>Equations</topic><topic>Fourier series</topic><topic>Insulated gate bipolar transistors</topic><topic>Integrated circuit packaging</topic><topic>Mathematical model</topic><topic>Thermal engineering</topic><toplevel>online_resources</toplevel><creatorcontrib>Swan, I.R.</creatorcontrib><creatorcontrib>Bryant, A.T.</creatorcontrib><creatorcontrib>Mawby, P.A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library Online</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Swan, I.R.</au><au>Bryant, A.T.</au><au>Mawby, P.A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Fast Thermal Models for Power Device Packaging</atitle><btitle>2008 IEEE Industry Applications Society Annual Meeting</btitle><stitle>IAS</stitle><date>2008-10</date><risdate>2008</risdate><spage>1</spage><epage>8</epage><pages>1-8</pages><issn>0197-2618</issn><eissn>2576-702X</eissn><isbn>9781424422784</isbn><isbn>1424422787</isbn><eisbn>9781424422791</eisbn><eisbn>1424422795</eisbn><abstract>This paper describes the development and implementation of an analytical thermal model for fast and accurate thermal simulations of power device modules. A Fourier-based solution is used to solve the heat equation in two dimensions. The solution can describe the variation of temperature through the structure versus time. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink. The model has been validated against FEM simulations and the difference between the two models has been illustrated. The required aspects of heat diffusion are captured successfully by the Fourier-based model.</abstract><pub>IEEE</pub><doi>10.1109/08IAS.2008.359</doi><tpages>8</tpages></addata></record> |
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| identifier | ISSN: 0197-2618 |
| ispartof | 2008 IEEE Industry Applications Society Annual Meeting, 2008, p.1-8 |
| issn | 0197-2618 2576-702X |
| language | eng |
| recordid | cdi_ieee_primary_4659147 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Analytical models Circuit simulation Computational modeling Electronic packaging thermal management Equations Fourier series Insulated gate bipolar transistors Integrated circuit packaging Mathematical model Thermal engineering |
| title | Fast Thermal Models for Power Device Packaging |
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