An ultra-miniaturized transceiver module for Bluetooth applications using 3-D LTCC system-on-package technology
In this paper, an ultra miniaturized transceiver module for Bluetooth applications using 3-D LTCC system-on-package technology is presented. The proposed compact LTCC Bluetooth module is monolithically implemented with 0.5 mm thickness substrate embedding all passive components such as bandpass filt...
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| creator | Yun-Hee Cho Jin-Wan Kim Park, Yun-Hwi |
| description | In this paper, an ultra miniaturized transceiver module for Bluetooth applications using 3-D LTCC system-on-package technology is presented. The proposed compact LTCC Bluetooth module is monolithically implemented with 0.5 mm thickness substrate embedding all passive components such as bandpass filter, balun, matching circuit, resistor, RF choke and bypass capacitor in order to reduce the overall size of module. The whole size of module is as small as 4.3 × 4.1 × 1.2 mm, which is the smallest size in the Bluetooth modules. The fabricated Bluetooth module reveals a transmit power of over 1 dBm and a sensitivity of −83 dBm. |
| doi_str_mv | 10.1109/MWSYM.2008.4633088 |
| format | Conference Proceeding |
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The proposed compact LTCC Bluetooth module is monolithically implemented with 0.5 mm thickness substrate embedding all passive components such as bandpass filter, balun, matching circuit, resistor, RF choke and bypass capacitor in order to reduce the overall size of module. The whole size of module is as small as 4.3 × 4.1 × 1.2 mm, which is the smallest size in the Bluetooth modules. The fabricated Bluetooth module reveals a transmit power of over 1 dBm and a sensitivity of −83 dBm.</description><subject>Band pass filters</subject><subject>Bluetooth</subject><subject>Capacitors</subject><subject>embedded</subject><subject>Impedance matching</subject><subject>Integrated circuits</subject><subject>LTCC</subject><subject>Radio frequency</subject><subject>Substrates</subject><issn>0149-645X</issn><issn>2576-7216</issn><isbn>1424417805</isbn><isbn>9781424417803</isbn><isbn>1424417813</isbn><isbn>9781424417810</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFUEtLAzEYjI-Ca-0f0Ev-QGqe-zjW-oQWDxbUU0my37bR3c2yyQr111ux4FxmmIGBGYQuGZ0yRovr5evL-3LKKc2nMhWC5vkROmeSS8mynIljlHCVpSTjLD35D6g6RQllsiCpVG8jlGTZr2JcnaFJCB90D6kE5yxBftbioY69Jo1rnY5D776hxHujDRbcF_S48eVQA658j2_qAaL3cYt119XO6uh8G_AQXLvBgtzixWo-x2EXIjTEt6TT9lNvAEew29bXfrO7QKNK1wEmBx6j1f3dav5IFs8PT_PZgriCRlKZEqAyioO1IDgwUdDMVMaaUlvQaWXLQjIDzKrccGbTzMi0LKv9yExSocQYXf3VOgBYd71rdL9bHz4UP1hjYwg</recordid><startdate>200806</startdate><enddate>200806</enddate><creator>Yun-Hee Cho</creator><creator>Jin-Wan Kim</creator><creator>Park, Yun-Hwi</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200806</creationdate><title>An ultra-miniaturized transceiver module for Bluetooth applications using 3-D LTCC system-on-package technology</title><author>Yun-Hee Cho ; Jin-Wan Kim ; Park, Yun-Hwi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-fbdeefb52ecce32e13907bfbcbdacea6fcd941be1c58b21c67b46ddf451740353</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Band pass filters</topic><topic>Bluetooth</topic><topic>Capacitors</topic><topic>embedded</topic><topic>Impedance matching</topic><topic>Integrated circuits</topic><topic>LTCC</topic><topic>Radio frequency</topic><topic>Substrates</topic><toplevel>online_resources</toplevel><creatorcontrib>Yun-Hee Cho</creatorcontrib><creatorcontrib>Jin-Wan Kim</creatorcontrib><creatorcontrib>Park, Yun-Hwi</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yun-Hee Cho</au><au>Jin-Wan Kim</au><au>Park, Yun-Hwi</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>An ultra-miniaturized transceiver module for Bluetooth applications using 3-D LTCC system-on-package technology</atitle><btitle>2008 IEEE MTT-S International Microwave Symposium Digest</btitle><stitle>MWSYM</stitle><date>2008-06</date><risdate>2008</risdate><spage>1</spage><epage>4</epage><pages>1-4</pages><issn>0149-645X</issn><eissn>2576-7216</eissn><isbn>1424417805</isbn><isbn>9781424417803</isbn><eisbn>1424417813</eisbn><eisbn>9781424417810</eisbn><abstract>In this paper, an ultra miniaturized transceiver module for Bluetooth applications using 3-D LTCC system-on-package technology is presented. The proposed compact LTCC Bluetooth module is monolithically implemented with 0.5 mm thickness substrate embedding all passive components such as bandpass filter, balun, matching circuit, resistor, RF choke and bypass capacitor in order to reduce the overall size of module. The whole size of module is as small as 4.3 × 4.1 × 1.2 mm, which is the smallest size in the Bluetooth modules. The fabricated Bluetooth module reveals a transmit power of over 1 dBm and a sensitivity of −83 dBm.</abstract><pub>IEEE</pub><doi>10.1109/MWSYM.2008.4633088</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0149-645X |
| ispartof | 2008 IEEE MTT-S International Microwave Symposium Digest, 2008, p.1-4 |
| issn | 0149-645X 2576-7216 |
| language | eng |
| recordid | cdi_ieee_primary_4633088 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Band pass filters Bluetooth Capacitors embedded Impedance matching Integrated circuits LTCC Radio frequency Substrates |
| title | An ultra-miniaturized transceiver module for Bluetooth applications using 3-D LTCC system-on-package technology |
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