Conductive pattern forming method on vertical wall using spray coating and angled exposure technologies
A novel conductive pattern forming method on the vertical wall using a resist spray coating and an angled exposure technologies is proposed. This method makes it possible to decrease the chip package size. The spray coating and the angled exposure technologies enable the uniform resist coating and t...
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| creator | Morii, H. Oohira, F. Sasaki, M. Ochi, T. Yuzuriha, A. |
| description | A novel conductive pattern forming method on the vertical wall using a resist spray coating and an angled exposure technologies is proposed. This method makes it possible to decrease the chip package size. The spray coating and the angled exposure technologies enable the uniform resist coating and the patterning the resist on the vertical wall of 600 mum height. Then a conductive pattern layers are sputtered and electroless plated. As the result, the conductive patterns of 200 mum width and 300 mum spacing is successfully formed on the vertical walls. |
| doi_str_mv | 10.1109/OMEMS.2008.4607876 |
| format | Conference Proceeding |
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This method makes it possible to decrease the chip package size. The spray coating and the angled exposure technologies enable the uniform resist coating and the patterning the resist on the vertical wall of 600 mum height. Then a conductive pattern layers are sputtered and electroless plated. As the result, the conductive patterns of 200 mum width and 300 mum spacing is successfully formed on the vertical walls.</description><identifier>ISSN: 2160-5033</identifier><identifier>ISBN: 1424419174</identifier><identifier>ISBN: 9781424419173</identifier><identifier>EISBN: 1424419182</identifier><identifier>EISBN: 9781424419180</identifier><identifier>DOI: 10.1109/OMEMS.2008.4607876</identifier><identifier>LCCN: 2007909044</identifier><language>eng</language><publisher>IEEE</publisher><subject>angled exposure ; Coatings ; Glass ; Materials ; MEMS ; Optical devices ; Packaging ; Plastics ; Resists ; spray coating</subject><ispartof>2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics, 2008, p.156-157</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4607876$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2051,27904,54898</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4607876$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Morii, H.</creatorcontrib><creatorcontrib>Oohira, F.</creatorcontrib><creatorcontrib>Sasaki, M.</creatorcontrib><creatorcontrib>Ochi, T.</creatorcontrib><creatorcontrib>Yuzuriha, A.</creatorcontrib><title>Conductive pattern forming method on vertical wall using spray coating and angled exposure technologies</title><title>2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics</title><addtitle>OMEMS</addtitle><description>A novel conductive pattern forming method on the vertical wall using a resist spray coating and an angled exposure technologies is proposed. This method makes it possible to decrease the chip package size. The spray coating and the angled exposure technologies enable the uniform resist coating and the patterning the resist on the vertical wall of 600 mum height. Then a conductive pattern layers are sputtered and electroless plated. As the result, the conductive patterns of 200 mum width and 300 mum spacing is successfully formed on the vertical walls.</description><subject>angled exposure</subject><subject>Coatings</subject><subject>Glass</subject><subject>Materials</subject><subject>MEMS</subject><subject>Optical devices</subject><subject>Packaging</subject><subject>Plastics</subject><subject>Resists</subject><subject>spray coating</subject><issn>2160-5033</issn><isbn>1424419174</isbn><isbn>9781424419173</isbn><isbn>1424419182</isbn><isbn>9781424419180</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFUNtqwkAU3NIKVesPtC_7A7F7vzwWsRdQfGj7LMvuSUyJ2ZBdbf37Rip0YBiGYQ6cQeiekjmlxD5u1sv1-5wRYuZCEW20ukITKpgQ1FLDrv-NFjdozKgihSScj9BkKGlLLBHiFs1S-iIDhOSCqzGqFrENB5_rI-DO5Qx9i8vY7-u2wnvIuxhwbPER-lx71-Bv1zT4kM5p6np3wj66fHauDQOrBgKGny6mQw84g9-1sYlVDekOjUrXJJhddIo-n5cfi9ditXl5WzytippqmQvvg7euFEIZAyACp54Z64JRLARHh98YYVJ66U1JbCAaONNBKwCpHJSST9HD390aALZdX-9df9peFuO_voVd2g</recordid><startdate>200808</startdate><enddate>200808</enddate><creator>Morii, H.</creator><creator>Oohira, F.</creator><creator>Sasaki, M.</creator><creator>Ochi, T.</creator><creator>Yuzuriha, A.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200808</creationdate><title>Conductive pattern forming method on vertical wall using spray coating and angled exposure technologies</title><author>Morii, H. ; Oohira, F. ; Sasaki, M. ; Ochi, T. ; Yuzuriha, A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-ccdc9af44688ee4d31c289ad862dda117420255c5c8f09d07e327d76ee56aef53</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>angled exposure</topic><topic>Coatings</topic><topic>Glass</topic><topic>Materials</topic><topic>MEMS</topic><topic>Optical devices</topic><topic>Packaging</topic><topic>Plastics</topic><topic>Resists</topic><topic>spray coating</topic><toplevel>online_resources</toplevel><creatorcontrib>Morii, H.</creatorcontrib><creatorcontrib>Oohira, F.</creatorcontrib><creatorcontrib>Sasaki, M.</creatorcontrib><creatorcontrib>Ochi, T.</creatorcontrib><creatorcontrib>Yuzuriha, A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Morii, H.</au><au>Oohira, F.</au><au>Sasaki, M.</au><au>Ochi, T.</au><au>Yuzuriha, A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Conductive pattern forming method on vertical wall using spray coating and angled exposure technologies</atitle><btitle>2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics</btitle><stitle>OMEMS</stitle><date>2008-08</date><risdate>2008</risdate><spage>156</spage><epage>157</epage><pages>156-157</pages><issn>2160-5033</issn><isbn>1424419174</isbn><isbn>9781424419173</isbn><eisbn>1424419182</eisbn><eisbn>9781424419180</eisbn><abstract>A novel conductive pattern forming method on the vertical wall using a resist spray coating and an angled exposure technologies is proposed. This method makes it possible to decrease the chip package size. The spray coating and the angled exposure technologies enable the uniform resist coating and the patterning the resist on the vertical wall of 600 mum height. Then a conductive pattern layers are sputtered and electroless plated. As the result, the conductive patterns of 200 mum width and 300 mum spacing is successfully formed on the vertical walls.</abstract><pub>IEEE</pub><doi>10.1109/OMEMS.2008.4607876</doi><tpages>2</tpages></addata></record> |
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| issn | 2160-5033 |
| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | angled exposure Coatings Glass Materials MEMS Optical devices Packaging Plastics Resists spray coating |
| title | Conductive pattern forming method on vertical wall using spray coating and angled exposure technologies |
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