Electromagnetic and Thermal Co-Analysis for distributed co-design and co-simulation of Chip, Package And Board

This paper discusses electromagnetic (EM) and thermal co-analysis for chip, package and board co-design and co-simulation. The limitation of classical divide-and-conquer approaches based on cascading techniques are investigated in reference to global methodologies where chip, package and board are s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wane, S., An-Yu Kuo
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Analytical models Chip-Package-Board Co-design/Cosimulation Circuit simulation Circuit synthesis CMOS technology Electromagnetic analysis Electromagnetic and Thermal Co-analysis Electromagnetic coupling Electromagnetic modeling Integrated circuit packaging Solid modeling Switching circuits
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