Stress-induced defect generation in HfO2/SiO2 stacks observed by using charge pumping and low frequency noise measurements

The technique of combining the low frequency drain current noise and the frequency-dependent charge pumping techniques has been employed to extract the trap densities in both the interfacial SiO 2 layer and high-k layer in the n-type MOSFETs with HfO 2 /SiO 2 stacks. It is found that positive bias s...

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Hauptverfasser: Xiong, H.D., Dawei Heh, Shuo Yang, Xiaoxiao Zhu, Gurfinkel, M., Bersuker, G., Ioannou, D.E., Richter, C.A., Cheung, K.P., Suehle, J.S.
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creator Xiong, H.D.
Dawei Heh
Shuo Yang
Xiaoxiao Zhu
Gurfinkel, M.
Bersuker, G.
Ioannou, D.E.
Richter, C.A.
Cheung, K.P.
Suehle, J.S.
description The technique of combining the low frequency drain current noise and the frequency-dependent charge pumping techniques has been employed to extract the trap densities in both the interfacial SiO 2 layer and high-k layer in the n-type MOSFETs with HfO 2 /SiO 2 stacks. It is found that positive bias stress creates more traps in the gate dielectric stack near the gate electrode while negative stress increases the density of traps generated in the proximity of the Si substrate. The results show that under electrical stress new traps are predominantly created close to the anode side and the degree of asymmetry is surprisingly large.
doi_str_mv 10.1109/RELPHY.2008.4558905
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1938-1891
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects 1/ƒ noise
Charge pumping
Charge pumps
defect generation
Dielectric substrates
Electrodes
Frequency
Hafnium oxide
HfO 2
High K dielectric materials
High-K gate dielectrics
Low-frequency noise
MOSFETs
oxide trap
Stress
title Stress-induced defect generation in HfO2/SiO2 stacks observed by using charge pumping and low frequency noise measurements
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