Application of through mold via (TMV) as PoP base package

In recent years, package-on-package (PoP) has been rapidly adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. However, existing methods of making the PoP base package may not satisfy next generation applications that will require reduced memo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Jinseong Kim, Kiwook Lee, Dongjoo Park, Taekyung Hwang, Kwangho Kim, Daebyoung Kang, Jaedong Kim, Choonheung Lee, Scanlan, C., Berry, C.J., Zwenger, C., Smith, L., Dreiza, M., Darveaux, R.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Logic devices Memory architecture Packaging Stacking Telephone sets Testing Thickness control Vehicles Wire
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!