Application of through mold via (TMV) as PoP base package
In recent years, package-on-package (PoP) has been rapidly adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. However, existing methods of making the PoP base package may not satisfy next generation applications that will require reduced memo...
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| creator | Jinseong Kim Kiwook Lee Dongjoo Park Taekyung Hwang Kwangho Kim Daebyoung Kang Jaedong Kim Choonheung Lee Scanlan, C. Berry, C.J. Zwenger, C. Smith, L. Dreiza, M. Darveaux, R. |
| description | In recent years, package-on-package (PoP) has been rapidly adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. However, existing methods of making the PoP base package may not satisfy next generation applications that will require reduced memory interface pitches, higher memory interface pin-counts, reduced thickness, tight warpage control and higher levels of integration within the PoP base package. This paper introduces a new PoP base package structure that addresses the challenges of next generation applications. A PoP base package with through mold vias (TMV) will be described. Package flatness and package stacking results will be presented and advantages of TMV technology will be reviewed. |
| doi_str_mv | 10.1109/ECTC.2008.4550110 |
| format | Conference Proceeding |
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Package flatness and package stacking results will be presented and advantages of TMV technology will be reviewed.</description><subject>Bonding</subject><subject>Logic devices</subject><subject>Memory architecture</subject><subject>Packaging</subject><subject>Stacking</subject><subject>Telephone sets</subject><subject>Testing</subject><subject>Thickness control</subject><subject>Vehicles</subject><subject>Wire</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>9781424422302</isbn><isbn>1424422302</isbn><isbn>9781424422319</isbn><isbn>1424422310</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpVkD1PwzAYhM2XRFTyAxCLRxgSbL-vY3usovIhFdEhsFZ2bLeBlERJqcS_JxJduOWke3Q3HCHXnOWcM3O_KKsyF4zpHKVkU3RCUqM0R4EoBHBzShIBSmVSieLsH2PinCRMFiabmnBJ0nH8YJNQQgEqIWbe921T233TfdEu0v126L43W7rrWk8PjaW31cv7HbUjXXUr6uwYaG_rT7sJV-Qi2nYM6dFn5O1hUZVP2fL18bmcL7OGK7nPpCuE8dZJxBgcKm4Yei2jBWc06Og1RkARfB1BKwuhdtxEr5jzCrxCmJGbv90mhLDuh2Znh5_18Qj4BVCoSvs</recordid><startdate>200805</startdate><enddate>200805</enddate><creator>Jinseong Kim</creator><creator>Kiwook Lee</creator><creator>Dongjoo Park</creator><creator>Taekyung Hwang</creator><creator>Kwangho Kim</creator><creator>Daebyoung Kang</creator><creator>Jaedong Kim</creator><creator>Choonheung Lee</creator><creator>Scanlan, C.</creator><creator>Berry, C.J.</creator><creator>Zwenger, C.</creator><creator>Smith, L.</creator><creator>Dreiza, M.</creator><creator>Darveaux, R.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200805</creationdate><title>Application of through mold via (TMV) as PoP base package</title><author>Jinseong Kim ; Kiwook Lee ; Dongjoo Park ; Taekyung Hwang ; Kwangho Kim ; Daebyoung Kang ; Jaedong Kim ; Choonheung Lee ; Scanlan, C. ; Berry, C.J. ; Zwenger, C. ; Smith, L. ; Dreiza, M. ; Darveaux, R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-5b629dab544feb471904d85fa3b9838fd84f342edcf387a3ecb19fd70bd73d743</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Bonding</topic><topic>Logic devices</topic><topic>Memory architecture</topic><topic>Packaging</topic><topic>Stacking</topic><topic>Telephone sets</topic><topic>Testing</topic><topic>Thickness control</topic><topic>Vehicles</topic><topic>Wire</topic><toplevel>online_resources</toplevel><creatorcontrib>Jinseong Kim</creatorcontrib><creatorcontrib>Kiwook Lee</creatorcontrib><creatorcontrib>Dongjoo Park</creatorcontrib><creatorcontrib>Taekyung Hwang</creatorcontrib><creatorcontrib>Kwangho Kim</creatorcontrib><creatorcontrib>Daebyoung Kang</creatorcontrib><creatorcontrib>Jaedong Kim</creatorcontrib><creatorcontrib>Choonheung Lee</creatorcontrib><creatorcontrib>Scanlan, C.</creatorcontrib><creatorcontrib>Berry, C.J.</creatorcontrib><creatorcontrib>Zwenger, C.</creatorcontrib><creatorcontrib>Smith, L.</creatorcontrib><creatorcontrib>Dreiza, M.</creatorcontrib><creatorcontrib>Darveaux, R.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jinseong Kim</au><au>Kiwook Lee</au><au>Dongjoo Park</au><au>Taekyung Hwang</au><au>Kwangho Kim</au><au>Daebyoung Kang</au><au>Jaedong Kim</au><au>Choonheung Lee</au><au>Scanlan, C.</au><au>Berry, C.J.</au><au>Zwenger, C.</au><au>Smith, L.</au><au>Dreiza, M.</au><au>Darveaux, R.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Application of through mold via (TMV) as PoP base package</atitle><btitle>2008 58th Electronic Components and Technology Conference</btitle><stitle>ECTC</stitle><date>2008-05</date><risdate>2008</risdate><spage>1089</spage><epage>1092</epage><pages>1089-1092</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>9781424422302</isbn><isbn>1424422302</isbn><eisbn>9781424422319</eisbn><eisbn>1424422310</eisbn><abstract>In recent years, package-on-package (PoP) has been rapidly adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. However, existing methods of making the PoP base package may not satisfy next generation applications that will require reduced memory interface pitches, higher memory interface pin-counts, reduced thickness, tight warpage control and higher levels of integration within the PoP base package. This paper introduces a new PoP base package structure that addresses the challenges of next generation applications. A PoP base package with through mold vias (TMV) will be described. Package flatness and package stacking results will be presented and advantages of TMV technology will be reviewed.</abstract><pub>IEEE</pub><doi>10.1109/ECTC.2008.4550110</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0569-5503 |
| ispartof | 2008 58th Electronic Components and Technology Conference, 2008, p.1089-1092 |
| issn | 0569-5503 2377-5726 |
| language | eng |
| recordid | cdi_ieee_primary_4550110 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Bonding Logic devices Memory architecture Packaging Stacking Telephone sets Testing Thickness control Vehicles Wire |
| title | Application of through mold via (TMV) as PoP base package |
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