Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance

The trend toward finer pitch and higher performance integrated circuits (ICs) devices has driven the semiconductor industry to incorporate copper and low-k dielectric materials. However, the low-k materials have lower modulus and poorer adhesion compared to the common dielectric materials. Thus, the...

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Bibliographische Detailangaben

Hauptverfasser:	Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Tan, J.B., Sohn, D.K.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Copper Dielectric materials Electronics industry Flip chip Integrated circuit interconnections Integrated circuit packaging Integrated circuit reliability Semiconductor device packaging Soldering Substrates
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