Analysis of different feedback topologies to LNA input matching
This paper describes the analysis of different feedback topologies to LNA input matching. The effect of different components to LNA input impedance is discussed. Analyzed feedback topologies can also be used to eliminate the source inductor found in IDCS LNA and feedback can be used to achieve match...
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creator | Kaltiokallio, M. Kaukovuori, J. Ryynanen, J. |
description | This paper describes the analysis of different feedback topologies to LNA input matching. The effect of different components to LNA input impedance is discussed. Analyzed feedback topologies can also be used to eliminate the source inductor found in IDCS LNA and feedback can be used to achieve matching in packaged LNA where the bond wire is no longer a free design parameter. A design example, using a 1.2-V 65-nm CMOS process, is given for a packaged LNA to demonstrate that adequate performance can be achieved using the presented theory and topologies. |
doi_str_mv | 10.1109/ECCTD.2007.4529538 |
format | Conference Proceeding |
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The effect of different components to LNA input impedance is discussed. Analyzed feedback topologies can also be used to eliminate the source inductor found in IDCS LNA and feedback can be used to achieve matching in packaged LNA where the bond wire is no longer a free design parameter. A design example, using a 1.2-V 65-nm CMOS process, is given for a packaged LNA to demonstrate that adequate performance can be achieved using the presented theory and topologies.</description><identifier>ISBN: 1424413419</identifier><identifier>ISBN: 9781424413416</identifier><identifier>EISBN: 1424413427</identifier><identifier>EISBN: 9781424413423</identifier><identifier>DOI: 10.1109/ECCTD.2007.4529538</identifier><identifier>LCCN: 2007928156</identifier><language>eng</language><publisher>IEEE</publisher><subject>Bonding ; Capacitance ; Circuit topology ; Feedback ; Frequency ; Impedance matching ; Inductors ; Packaging ; Wideband ; Wire</subject><ispartof>2007 18th European Conference on Circuit Theory and Design, 2007, p.68-71</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4529538$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4529538$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Kaltiokallio, M.</creatorcontrib><creatorcontrib>Kaukovuori, J.</creatorcontrib><creatorcontrib>Ryynanen, J.</creatorcontrib><title>Analysis of different feedback topologies to LNA input matching</title><title>2007 18th European Conference on Circuit Theory and Design</title><addtitle>ECCTD</addtitle><description>This paper describes the analysis of different feedback topologies to LNA input matching. The effect of different components to LNA input impedance is discussed. Analyzed feedback topologies can also be used to eliminate the source inductor found in IDCS LNA and feedback can be used to achieve matching in packaged LNA where the bond wire is no longer a free design parameter. A design example, using a 1.2-V 65-nm CMOS process, is given for a packaged LNA to demonstrate that adequate performance can be achieved using the presented theory and topologies.</description><subject>Bonding</subject><subject>Capacitance</subject><subject>Circuit topology</subject><subject>Feedback</subject><subject>Frequency</subject><subject>Impedance matching</subject><subject>Inductors</subject><subject>Packaging</subject><subject>Wideband</subject><subject>Wire</subject><isbn>1424413419</isbn><isbn>9781424413416</isbn><isbn>1424413427</isbn><isbn>9781424413423</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFj9FKwzAYhSMy0M29gN7kBVbzJ3-S5kpK3VQoejOvR5KmM9q1pakXe3snDjw353xwOHAIuQWWATBzvy7L7WPGGdMZSm6kyC_IHJAjgkCuL_8BzIzMf4uG5yDVFVmm9MlOQomcqWvyUHS2PaaYaN_QOjZNGEM30SaE2ln_Rad-6Nt-H0M6RVq9FjR2w_dED3byH7Hb35BZY9sUlmdfkPfNels-r6q3p5eyqFYRtJxW3GgmjHdBgkTmlXcu1wGdA0CsjQchFGowdXDKGeO4UjVaFJo3JueOiwW5-9uNIYTdMMaDHY-783vxA_LoSs8</recordid><startdate>200708</startdate><enddate>200708</enddate><creator>Kaltiokallio, M.</creator><creator>Kaukovuori, J.</creator><creator>Ryynanen, J.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200708</creationdate><title>Analysis of different feedback topologies to LNA input matching</title><author>Kaltiokallio, M. ; Kaukovuori, J. ; Ryynanen, J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-297039cbe51540c6cbb87e4bb1144d9c13364719deb6b99b266d4a4372f982b23</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Bonding</topic><topic>Capacitance</topic><topic>Circuit topology</topic><topic>Feedback</topic><topic>Frequency</topic><topic>Impedance matching</topic><topic>Inductors</topic><topic>Packaging</topic><topic>Wideband</topic><topic>Wire</topic><toplevel>online_resources</toplevel><creatorcontrib>Kaltiokallio, M.</creatorcontrib><creatorcontrib>Kaukovuori, J.</creatorcontrib><creatorcontrib>Ryynanen, J.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kaltiokallio, M.</au><au>Kaukovuori, J.</au><au>Ryynanen, J.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Analysis of different feedback topologies to LNA input matching</atitle><btitle>2007 18th European Conference on Circuit Theory and Design</btitle><stitle>ECCTD</stitle><date>2007-08</date><risdate>2007</risdate><spage>68</spage><epage>71</epage><pages>68-71</pages><isbn>1424413419</isbn><isbn>9781424413416</isbn><eisbn>1424413427</eisbn><eisbn>9781424413423</eisbn><abstract>This paper describes the analysis of different feedback topologies to LNA input matching. The effect of different components to LNA input impedance is discussed. Analyzed feedback topologies can also be used to eliminate the source inductor found in IDCS LNA and feedback can be used to achieve matching in packaged LNA where the bond wire is no longer a free design parameter. A design example, using a 1.2-V 65-nm CMOS process, is given for a packaged LNA to demonstrate that adequate performance can be achieved using the presented theory and topologies.</abstract><pub>IEEE</pub><doi>10.1109/ECCTD.2007.4529538</doi><tpages>4</tpages></addata></record> |
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subjects | Bonding Capacitance Circuit topology Feedback Frequency Impedance matching Inductors Packaging Wideband Wire |
title | Analysis of different feedback topologies to LNA input matching |
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