PC Board Thermal Management of High Power LEDs
Increasing requirements of closely packed high power LEDs pose challenges for PC board thermal management. This paper presents a cost-effective thermal solution using FR4 based PCB technology and filled and capped vias. This robust technology enables superior thermal performance on board level for c...
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| creator | Yu, J.H. Oepts, W. Konijn, H. |
| description | Increasing requirements of closely packed high power LEDs pose challenges for PC board thermal management. This paper presents a cost-effective thermal solution using FR4 based PCB technology and filled and capped vias. This robust technology enables superior thermal performance on board level for closely packed power LEDs. No solder joint or board level reliability failures were found during a temperature cycling test (TCT) from -40degC to 125degC after 1000 cycles. Moreover no solder joint and board level failure was found after 4000 cycles for open via FR4 when monitoring changes of board thermal resistance. Trade-offs are given for board thermal resistance versus packing density, various board designs, PCB technology, solder joint reliability and PCB board level reliability including open vias and filled and capped vias. |
| doi_str_mv | 10.1109/STHERM.2008.4509368 |
| format | Conference Proceeding |
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This paper presents a cost-effective thermal solution using FR4 based PCB technology and filled and capped vias. This robust technology enables superior thermal performance on board level for closely packed power LEDs. No solder joint or board level reliability failures were found during a temperature cycling test (TCT) from -40degC to 125degC after 1000 cycles. Moreover no solder joint and board level failure was found after 4000 cycles for open via FR4 when monitoring changes of board thermal resistance. 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This paper presents a cost-effective thermal solution using FR4 based PCB technology and filled and capped vias. This robust technology enables superior thermal performance on board level for closely packed power LEDs. No solder joint or board level reliability failures were found during a temperature cycling test (TCT) from -40degC to 125degC after 1000 cycles. Moreover no solder joint and board level failure was found after 4000 cycles for open via FR4 when monitoring changes of board thermal resistance. Trade-offs are given for board thermal resistance versus packing density, various board designs, PCB technology, solder joint reliability and PCB board level reliability including open vias and filled and capped vias.</description><subject>board thermal resistance</subject><subject>closely or densely packed LEDs</subject><subject>Copper</subject><subject>Energy management</subject><subject>FR4 filled and capped vias</subject><subject>Light emitting diodes</subject><subject>PC board reliability</subject><subject>PC board thermal management</subject><subject>Power LEDs</subject><subject>Power system management</subject><subject>solder joint reliability</subject><subject>Soldering</subject><subject>Surface resistance</subject><subject>Temperature</subject><subject>Thermal conductivity</subject><subject>Thermal management</subject><subject>Thermal resistance</subject><issn>1065-2221</issn><issn>2577-1000</issn><isbn>1424421233</isbn><isbn>9781424421237</isbn><isbn>1424421241</isbn><isbn>9781424421244</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFj81Kw0AURsc_sK0-QTfzAon33vnLLLVGI6RYNPsyydy0kbaRpCC-vYIFV9_iHA58QswRUkTwd-9Vkb8tUwLIUm3AK5udiSlq0pqQNJ6LCRnnEgSAi3-g1KWYIFiTEBFei-k4fvwajqyZiHS1kA99GKKstjzsw04uwyFseM-Ho-xbWXSbrVz1XzzIMn8cb8RVG3Yj3552JqqnvFoUSfn6_LK4L5POwzFpWqQQvXGRo69NaA1wVLV1GLPoLKIyjq0mxY1vHChtVUvAxocsZrWLaibmf9mOmdefQ7cPw_f69Fn9AOZ_RQI</recordid><startdate>200803</startdate><enddate>200803</enddate><creator>Yu, J.H.</creator><creator>Oepts, W.</creator><creator>Konijn, H.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200803</creationdate><title>PC Board Thermal Management of High Power LEDs</title><author>Yu, J.H. ; Oepts, W. ; Konijn, H.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-cf12ad957ded9b5af50ed3b671d8d7611357e6423ec9c703463f20e59a8d8b7d3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>board thermal resistance</topic><topic>closely or densely packed LEDs</topic><topic>Copper</topic><topic>Energy management</topic><topic>FR4 filled and capped vias</topic><topic>Light emitting diodes</topic><topic>PC board reliability</topic><topic>PC board thermal management</topic><topic>Power LEDs</topic><topic>Power system management</topic><topic>solder joint reliability</topic><topic>Soldering</topic><topic>Surface resistance</topic><topic>Temperature</topic><topic>Thermal conductivity</topic><topic>Thermal management</topic><topic>Thermal resistance</topic><toplevel>online_resources</toplevel><creatorcontrib>Yu, J.H.</creatorcontrib><creatorcontrib>Oepts, W.</creatorcontrib><creatorcontrib>Konijn, H.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yu, J.H.</au><au>Oepts, W.</au><au>Konijn, H.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>PC Board Thermal Management of High Power LEDs</atitle><btitle>2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium</btitle><stitle>STHERM</stitle><date>2008-03</date><risdate>2008</risdate><spage>63</spage><epage>67</epage><pages>63-67</pages><issn>1065-2221</issn><eissn>2577-1000</eissn><isbn>1424421233</isbn><isbn>9781424421237</isbn><eisbn>1424421241</eisbn><eisbn>9781424421244</eisbn><abstract>Increasing requirements of closely packed high power LEDs pose challenges for PC board thermal management. This paper presents a cost-effective thermal solution using FR4 based PCB technology and filled and capped vias. This robust technology enables superior thermal performance on board level for closely packed power LEDs. No solder joint or board level reliability failures were found during a temperature cycling test (TCT) from -40degC to 125degC after 1000 cycles. Moreover no solder joint and board level failure was found after 4000 cycles for open via FR4 when monitoring changes of board thermal resistance. Trade-offs are given for board thermal resistance versus packing density, various board designs, PCB technology, solder joint reliability and PCB board level reliability including open vias and filled and capped vias.</abstract><pub>IEEE</pub><doi>10.1109/STHERM.2008.4509368</doi><tpages>5</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 1065-2221 |
| ispartof | 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2008, p.63-67 |
| issn | 1065-2221 2577-1000 |
| language | eng |
| recordid | cdi_ieee_primary_4509368 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | board thermal resistance closely or densely packed LEDs Copper Energy management FR4 filled and capped vias Light emitting diodes PC board reliability PC board thermal management Power LEDs Power system management solder joint reliability Soldering Surface resistance Temperature Thermal conductivity Thermal management Thermal resistance |
| title | PC Board Thermal Management of High Power LEDs |
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