Self-Assembly of Components using Shape-matching
This paper describes a process of mass self-assembly of micro-components onto a silicon substrate using mechanical shape-locking mechanism. Protrusions of certain pattern were electroplated onto 1 times 1 mm 2 micro-components. These protrusions served as a means for the micro-components to self-ass...
Gespeichert in:
| Hauptverfasser: | , , , , , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 829 |
|---|---|
| container_issue | |
| container_start_page | 826 |
| container_title | |
| container_volume | |
| creator | Ong, Y.Y. Lim, Y.L. Yan, L.L. Vempati, S. Liao, E.B. Kripesh, V. Yoon, S.U. |
| description | This paper describes a process of mass self-assembly of micro-components onto a silicon substrate using mechanical shape-locking mechanism. Protrusions of certain pattern were electroplated onto 1 times 1 mm 2 micro-components. These protrusions served as a means for the micro-components to self-assemble onto the cavity receptor sites of the silicon substrate. The protrusions also served as an electrical interconnection between the micro-components and substrate. The self-assembly yield on an 8" wafer with ~1700 receptor sites is about 90% within 10 min. This parallel assembly technique demonstrates higher throughput for mass production, as compared to the conventional 'pick and place' technique. |
| doi_str_mv | 10.1109/EPTC.2007.4469815 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4469815</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4469815</ieee_id><sourcerecordid>4469815</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-b26b23570128dd74426754913a06ad183ffea97ed1256fcd92bcfae6116ebaad3</originalsourceid><addsrcrecordid>eNo1j8tKw0AUQEekoLb5AHGTH5h47zwzyxLqAwoKresyydyxkbzoxEX_XsG6OpzNgcPYPUKBCO5x876vCgFgC6WMK1FfsTtUQimUQsI1y5wt_125G5al9AUAaI1CYW4Z7KiLfJ0S9XV3zseYV2M_jQMNc8q_Uzt85rujn4j3fm6Ov7pii-i7RNmFS_bxtNlXL3z79vxarbe8RatnXgtTC6ktoChDsEoJY7VyKD0YH7CUMZJ3lgIKbWITnKib6MkgGqq9D3LJHv66LREdplPb-9P5cJmUPzbmRIo</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Self-Assembly of Components using Shape-matching</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Ong, Y.Y. ; Lim, Y.L. ; Yan, L.L. ; Vempati, S. ; Liao, E.B. ; Kripesh, V. ; Yoon, S.U.</creator><creatorcontrib>Ong, Y.Y. ; Lim, Y.L. ; Yan, L.L. ; Vempati, S. ; Liao, E.B. ; Kripesh, V. ; Yoon, S.U.</creatorcontrib><description>This paper describes a process of mass self-assembly of micro-components onto a silicon substrate using mechanical shape-locking mechanism. Protrusions of certain pattern were electroplated onto 1 times 1 mm 2 micro-components. These protrusions served as a means for the micro-components to self-assemble onto the cavity receptor sites of the silicon substrate. The protrusions also served as an electrical interconnection between the micro-components and substrate. The self-assembly yield on an 8" wafer with ~1700 receptor sites is about 90% within 10 min. This parallel assembly technique demonstrates higher throughput for mass production, as compared to the conventional 'pick and place' technique.</description><identifier>ISBN: 9781424413249</identifier><identifier>ISBN: 1424413249</identifier><identifier>EISBN: 1424413230</identifier><identifier>EISBN: 9781424413232</identifier><identifier>DOI: 10.1109/EPTC.2007.4469815</identifier><language>eng</language><publisher>IEEE</publisher><subject>Copper ; Fabrication ; Manipulators ; Robotic assembly ; Self-assembly ; Shape ; Silicon ; Substrates ; Throughput ; Wafer bonding</subject><ispartof>2007 9th Electronics Packaging Technology Conference, 2007, p.826-829</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4469815$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4469815$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ong, Y.Y.</creatorcontrib><creatorcontrib>Lim, Y.L.</creatorcontrib><creatorcontrib>Yan, L.L.</creatorcontrib><creatorcontrib>Vempati, S.</creatorcontrib><creatorcontrib>Liao, E.B.</creatorcontrib><creatorcontrib>Kripesh, V.</creatorcontrib><creatorcontrib>Yoon, S.U.</creatorcontrib><title>Self-Assembly of Components using Shape-matching</title><title>2007 9th Electronics Packaging Technology Conference</title><addtitle>EPTC</addtitle><description>This paper describes a process of mass self-assembly of micro-components onto a silicon substrate using mechanical shape-locking mechanism. Protrusions of certain pattern were electroplated onto 1 times 1 mm 2 micro-components. These protrusions served as a means for the micro-components to self-assemble onto the cavity receptor sites of the silicon substrate. The protrusions also served as an electrical interconnection between the micro-components and substrate. The self-assembly yield on an 8" wafer with ~1700 receptor sites is about 90% within 10 min. This parallel assembly technique demonstrates higher throughput for mass production, as compared to the conventional 'pick and place' technique.</description><subject>Copper</subject><subject>Fabrication</subject><subject>Manipulators</subject><subject>Robotic assembly</subject><subject>Self-assembly</subject><subject>Shape</subject><subject>Silicon</subject><subject>Substrates</subject><subject>Throughput</subject><subject>Wafer bonding</subject><isbn>9781424413249</isbn><isbn>1424413249</isbn><isbn>1424413230</isbn><isbn>9781424413232</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1j8tKw0AUQEekoLb5AHGTH5h47zwzyxLqAwoKresyydyxkbzoxEX_XsG6OpzNgcPYPUKBCO5x876vCgFgC6WMK1FfsTtUQimUQsI1y5wt_125G5al9AUAaI1CYW4Z7KiLfJ0S9XV3zseYV2M_jQMNc8q_Uzt85rujn4j3fm6Ov7pii-i7RNmFS_bxtNlXL3z79vxarbe8RatnXgtTC6ktoChDsEoJY7VyKD0YH7CUMZJ3lgIKbWITnKib6MkgGqq9D3LJHv66LREdplPb-9P5cJmUPzbmRIo</recordid><startdate>200712</startdate><enddate>200712</enddate><creator>Ong, Y.Y.</creator><creator>Lim, Y.L.</creator><creator>Yan, L.L.</creator><creator>Vempati, S.</creator><creator>Liao, E.B.</creator><creator>Kripesh, V.</creator><creator>Yoon, S.U.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200712</creationdate><title>Self-Assembly of Components using Shape-matching</title><author>Ong, Y.Y. ; Lim, Y.L. ; Yan, L.L. ; Vempati, S. ; Liao, E.B. ; Kripesh, V. ; Yoon, S.U.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-b26b23570128dd74426754913a06ad183ffea97ed1256fcd92bcfae6116ebaad3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Copper</topic><topic>Fabrication</topic><topic>Manipulators</topic><topic>Robotic assembly</topic><topic>Self-assembly</topic><topic>Shape</topic><topic>Silicon</topic><topic>Substrates</topic><topic>Throughput</topic><topic>Wafer bonding</topic><toplevel>online_resources</toplevel><creatorcontrib>Ong, Y.Y.</creatorcontrib><creatorcontrib>Lim, Y.L.</creatorcontrib><creatorcontrib>Yan, L.L.</creatorcontrib><creatorcontrib>Vempati, S.</creatorcontrib><creatorcontrib>Liao, E.B.</creatorcontrib><creatorcontrib>Kripesh, V.</creatorcontrib><creatorcontrib>Yoon, S.U.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ong, Y.Y.</au><au>Lim, Y.L.</au><au>Yan, L.L.</au><au>Vempati, S.</au><au>Liao, E.B.</au><au>Kripesh, V.</au><au>Yoon, S.U.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Self-Assembly of Components using Shape-matching</atitle><btitle>2007 9th Electronics Packaging Technology Conference</btitle><stitle>EPTC</stitle><date>2007-12</date><risdate>2007</risdate><spage>826</spage><epage>829</epage><pages>826-829</pages><isbn>9781424413249</isbn><isbn>1424413249</isbn><eisbn>1424413230</eisbn><eisbn>9781424413232</eisbn><abstract>This paper describes a process of mass self-assembly of micro-components onto a silicon substrate using mechanical shape-locking mechanism. Protrusions of certain pattern were electroplated onto 1 times 1 mm 2 micro-components. These protrusions served as a means for the micro-components to self-assemble onto the cavity receptor sites of the silicon substrate. The protrusions also served as an electrical interconnection between the micro-components and substrate. The self-assembly yield on an 8" wafer with ~1700 receptor sites is about 90% within 10 min. This parallel assembly technique demonstrates higher throughput for mass production, as compared to the conventional 'pick and place' technique.</abstract><pub>IEEE</pub><doi>10.1109/EPTC.2007.4469815</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 9781424413249 |
| ispartof | 2007 9th Electronics Packaging Technology Conference, 2007, p.826-829 |
| issn | |
| language | eng |
| recordid | cdi_ieee_primary_4469815 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Copper Fabrication Manipulators Robotic assembly Self-assembly Shape Silicon Substrates Throughput Wafer bonding |
| title | Self-Assembly of Components using Shape-matching |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-19T11%3A37%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Self-Assembly%20of%20Components%20using%20Shape-matching&rft.btitle=2007%209th%20Electronics%20Packaging%20Technology%20Conference&rft.au=Ong,%20Y.Y.&rft.date=2007-12&rft.spage=826&rft.epage=829&rft.pages=826-829&rft.isbn=9781424413249&rft.isbn_list=1424413249&rft_id=info:doi/10.1109/EPTC.2007.4469815&rft_dat=%3Cieee_6IE%3E4469815%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424413230&rft.eisbn_list=9781424413232&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4469815&rfr_iscdi=true |