New Ultra Thin Chip Scale Package (CSP) based on Thermo-Sonic Flip-Chip Interconnection

This paper introduces a new chip scale package (CSP) platform, and its assembly process flow in detail. The concept uses the ultra-sonic / thermo-sonic flip-chip bonding of die onto re-distribution layer (RDL) pre-plated metal substrate. Package is then encapsulated with mold compound for structural...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Seung-Yong Choi, Ching-Shian Ti, Min-Hyo Park, Seng-Teong Chang
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Bonding Chemical compounds Chemical processes Chip scale packaging Etching Flip chip Resists Robustness Wire
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