Cu/Low-k TBGA Glob Top Package Reliability Challenges
Moving into low-k die packaging era, due to much weaker mechanical properties and poorer adhesion of interlayer dielectric, package reliability always poses a challenge to backend assembly process. This is especially critical for the cavity down tape ball grid array (TBGA) package. This paper discus...
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| creator | Lau Teck Beng Siong Chin Teck Chu-Chung Lee |
| description | Moving into low-k die packaging era, due to much weaker mechanical properties and poorer adhesion of interlayer dielectric, package reliability always poses a challenge to backend assembly process. This is especially critical for the cavity down tape ball grid array (TBGA) package. This paper discusses the approach taken to identify a feasible combination of material set and also the various process and design aspects that are important to lessen the overall package stress exerted onto the low-k die during reliability stress, primarily during temperature cycle test. Series of evaluations were conducted to derive a proven good solution for 44 mum fine pitch wire package and for Pb-free requirement. |
| doi_str_mv | 10.1109/IEMT.2006.4456469 |
| format | Conference Proceeding |
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| ispartof | 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2006, p.294-299 |
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| subjects | Adhesives Assembly Conducting materials Dielectric materials Electronics packaging Materials reliability Mechanical factors Process design Stress Temperature |
| title | Cu/Low-k TBGA Glob Top Package Reliability Challenges |
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