Slurry Usage Reduction for Failure Analysis Sample Preparation
This paper describes slurry usage reduction for failure analysis (FA). The slurry is applied during final fine polishing for scanning electron microscopy (SEM) sample preparation in failure analysis. The three main factors, slurry concentration, polishing time and down pressure have been evaluated t...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 3 |
|---|---|
| container_issue | |
| container_start_page | 1 |
| container_title | |
| container_volume | |
| creator | Bin Saee, S. Ng Hong Seng Tan Hong Mui |
| description | This paper describes slurry usage reduction for failure analysis (FA). The slurry is applied during final fine polishing for scanning electron microscopy (SEM) sample preparation in failure analysis. The three main factors, slurry concentration, polishing time and down pressure have been evaluated to maintain or improve the SEM images quality while reducing slurry consumables cost. The 0.05 mum blue colloidal silica diluted with de-ionized (DI) water with the ratio of 1:1 has been proven as optimized solution to save up to 46% of total slurry cost annually. |
| doi_str_mv | 10.1109/SCORED.2007.4451387 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4451387</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4451387</ieee_id><sourcerecordid>4451387</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-899c0cb3e3d06d07dace7aaa8e5f1193123ccaf76c8e3d35da21970d664086663</originalsourceid><addsrcrecordid>eNotj9tKw0AYhFdEUGueoDf7Aon_HrKHG6HEtgqFSlOvy-_uRiJpG3bbi7y9ETM3wzAfA0PInEHBGNjnutrulq8FB9CFlCUTRt-QRya5lExqsLcks9pMWVl9T7KUfmCULCXn9oG81N01xoF-JvwOdBf81V3a84k250hX2I5loIsTdkNqE63x2HeBfsTQY8Q_7oncNdilkE0-I_vVcl-95Zvt-r1abPLWwiU31jpwXyIID8qD9uiCRkQTyoYxKxgXzmGjlTMjIkqPnFkNXikJRiklZmT-P9uGEA59bI8Yh8P0WPwChzVKKQ</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Slurry Usage Reduction for Failure Analysis Sample Preparation</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Bin Saee, S. ; Ng Hong Seng ; Tan Hong Mui</creator><creatorcontrib>Bin Saee, S. ; Ng Hong Seng ; Tan Hong Mui</creatorcontrib><description>This paper describes slurry usage reduction for failure analysis (FA). The slurry is applied during final fine polishing for scanning electron microscopy (SEM) sample preparation in failure analysis. The three main factors, slurry concentration, polishing time and down pressure have been evaluated to maintain or improve the SEM images quality while reducing slurry consumables cost. The 0.05 mum blue colloidal silica diluted with de-ionized (DI) water with the ratio of 1:1 has been proven as optimized solution to save up to 46% of total slurry cost annually.</description><identifier>ISBN: 9781424414697</identifier><identifier>ISBN: 1424414695</identifier><identifier>EISBN: 1424414709</identifier><identifier>EISBN: 9781424414703</identifier><identifier>DOI: 10.1109/SCORED.2007.4451387</identifier><language>eng</language><publisher>IEEE</publisher><subject>Costs ; Delay ; Failure analysis ; Image quality ; Lapping ; Polishing machines ; Research and development ; Scanning electron microscopy ; Silicon compounds ; Slurries</subject><ispartof>2007 5th Student Conference on Research and Development, 2007, p.1-3</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4451387$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2056,27924,54919</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4451387$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Bin Saee, S.</creatorcontrib><creatorcontrib>Ng Hong Seng</creatorcontrib><creatorcontrib>Tan Hong Mui</creatorcontrib><title>Slurry Usage Reduction for Failure Analysis Sample Preparation</title><title>2007 5th Student Conference on Research and Development</title><addtitle>SCORED</addtitle><description>This paper describes slurry usage reduction for failure analysis (FA). The slurry is applied during final fine polishing for scanning electron microscopy (SEM) sample preparation in failure analysis. The three main factors, slurry concentration, polishing time and down pressure have been evaluated to maintain or improve the SEM images quality while reducing slurry consumables cost. The 0.05 mum blue colloidal silica diluted with de-ionized (DI) water with the ratio of 1:1 has been proven as optimized solution to save up to 46% of total slurry cost annually.</description><subject>Costs</subject><subject>Delay</subject><subject>Failure analysis</subject><subject>Image quality</subject><subject>Lapping</subject><subject>Polishing machines</subject><subject>Research and development</subject><subject>Scanning electron microscopy</subject><subject>Silicon compounds</subject><subject>Slurries</subject><isbn>9781424414697</isbn><isbn>1424414695</isbn><isbn>1424414709</isbn><isbn>9781424414703</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj9tKw0AYhFdEUGueoDf7Aon_HrKHG6HEtgqFSlOvy-_uRiJpG3bbi7y9ETM3wzAfA0PInEHBGNjnutrulq8FB9CFlCUTRt-QRya5lExqsLcks9pMWVl9T7KUfmCULCXn9oG81N01xoF-JvwOdBf81V3a84k250hX2I5loIsTdkNqE63x2HeBfsTQY8Q_7oncNdilkE0-I_vVcl-95Zvt-r1abPLWwiU31jpwXyIID8qD9uiCRkQTyoYxKxgXzmGjlTMjIkqPnFkNXikJRiklZmT-P9uGEA59bI8Yh8P0WPwChzVKKQ</recordid><startdate>200712</startdate><enddate>200712</enddate><creator>Bin Saee, S.</creator><creator>Ng Hong Seng</creator><creator>Tan Hong Mui</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200712</creationdate><title>Slurry Usage Reduction for Failure Analysis Sample Preparation</title><author>Bin Saee, S. ; Ng Hong Seng ; Tan Hong Mui</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-899c0cb3e3d06d07dace7aaa8e5f1193123ccaf76c8e3d35da21970d664086663</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Costs</topic><topic>Delay</topic><topic>Failure analysis</topic><topic>Image quality</topic><topic>Lapping</topic><topic>Polishing machines</topic><topic>Research and development</topic><topic>Scanning electron microscopy</topic><topic>Silicon compounds</topic><topic>Slurries</topic><toplevel>online_resources</toplevel><creatorcontrib>Bin Saee, S.</creatorcontrib><creatorcontrib>Ng Hong Seng</creatorcontrib><creatorcontrib>Tan Hong Mui</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bin Saee, S.</au><au>Ng Hong Seng</au><au>Tan Hong Mui</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Slurry Usage Reduction for Failure Analysis Sample Preparation</atitle><btitle>2007 5th Student Conference on Research and Development</btitle><stitle>SCORED</stitle><date>2007-12</date><risdate>2007</risdate><spage>1</spage><epage>3</epage><pages>1-3</pages><isbn>9781424414697</isbn><isbn>1424414695</isbn><eisbn>1424414709</eisbn><eisbn>9781424414703</eisbn><abstract>This paper describes slurry usage reduction for failure analysis (FA). The slurry is applied during final fine polishing for scanning electron microscopy (SEM) sample preparation in failure analysis. The three main factors, slurry concentration, polishing time and down pressure have been evaluated to maintain or improve the SEM images quality while reducing slurry consumables cost. The 0.05 mum blue colloidal silica diluted with de-ionized (DI) water with the ratio of 1:1 has been proven as optimized solution to save up to 46% of total slurry cost annually.</abstract><pub>IEEE</pub><doi>10.1109/SCORED.2007.4451387</doi><tpages>3</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 9781424414697 |
| ispartof | 2007 5th Student Conference on Research and Development, 2007, p.1-3 |
| issn | |
| language | eng |
| recordid | cdi_ieee_primary_4451387 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Costs Delay Failure analysis Image quality Lapping Polishing machines Research and development Scanning electron microscopy Silicon compounds Slurries |
| title | Slurry Usage Reduction for Failure Analysis Sample Preparation |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T10%3A21%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Slurry%20Usage%20Reduction%20for%20Failure%20Analysis%20Sample%20Preparation&rft.btitle=2007%205th%20Student%20Conference%20on%20Research%20and%20Development&rft.au=Bin%20Saee,%20S.&rft.date=2007-12&rft.spage=1&rft.epage=3&rft.pages=1-3&rft.isbn=9781424414697&rft.isbn_list=1424414695&rft_id=info:doi/10.1109/SCORED.2007.4451387&rft_dat=%3Cieee_6IE%3E4451387%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424414709&rft.eisbn_list=9781424414703&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4451387&rfr_iscdi=true |