Process start/end event detection and dynamic time warping algorithms for run-by-run process fault detection
In semiconductor/FPD (flat panel display) manufacturing environments, APC (advanced process control) is a vital task for enhancing yield. The APC technology improves the productivity of equipments based on two main control mechanisms: fault management and R2R (run-to-run) recipe correction. This pap...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 4 |
|---|---|
| container_issue | |
| container_start_page | 1 |
| container_title | |
| container_volume | |
| creator | Ja Young Choi Jong Myoung Ko Chang Ouk Kim Yoon Seong Kang Seung Jun Lee |
| description | In semiconductor/FPD (flat panel display) manufacturing environments, APC (advanced process control) is a vital task for enhancing yield. The APC technology improves the productivity of equipments based on two main control mechanisms: fault management and R2R (run-to-run) recipe correction. This paper focuses on FDC (fault detection and classification) for the fault management, and proposes a run-by-run process fault detection method. The method consists of a process event detection algorithm to segment process data, and a pattern matching technique to classify the segmented data as normal or abnormal state. Experiments using the data collected from a RIE (reactive ion etching) process show that the proposed method is able to recognize normal/abnormal states with high accuracy. |
| doi_str_mv | 10.1109/ISSM.2007.4446846 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4446846</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4446846</ieee_id><sourcerecordid>4446846</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-78c602a491f30c695f46826946495babc1b1f537ee880482eea8bd1a96b586193</originalsourceid><addsrcrecordid>eNpNkE1LxDAYhCMquK79AeIlf6DdvG2SJkdZ_FhYUdg9eFvS9u0a6RdJVum_t2AFLzPMHB6YIeQWWALA9Gqz270kKWN5wjmXisszEulcAU85h0n1Obn-CyAvyAJEmsVCZO9XJPL-kzEGueRMyAVp3lxfovfUB-PCCruK4hd2gVYYsAy276iZumrsTGtLGmyL9Nu4wXZHappj72z4aD2te0fdqYuLMZ6MDjO0NqfmH-qGXNam8RjNviT7x4f9-jnevj5t1vfb2GoW4lyVkqWGa6gzVkot6mlkKjWXXIvCFCUUUIssR1SKcZUiGlVUYLQshJKgsyW5-8VaRDwMzrbGjYf5q-wHzEJckA</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Process start/end event detection and dynamic time warping algorithms for run-by-run process fault detection</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Ja Young Choi ; Jong Myoung Ko ; Chang Ouk Kim ; Yoon Seong Kang ; Seung Jun Lee</creator><creatorcontrib>Ja Young Choi ; Jong Myoung Ko ; Chang Ouk Kim ; Yoon Seong Kang ; Seung Jun Lee</creatorcontrib><description>In semiconductor/FPD (flat panel display) manufacturing environments, APC (advanced process control) is a vital task for enhancing yield. The APC technology improves the productivity of equipments based on two main control mechanisms: fault management and R2R (run-to-run) recipe correction. This paper focuses on FDC (fault detection and classification) for the fault management, and proposes a run-by-run process fault detection method. The method consists of a process event detection algorithm to segment process data, and a pattern matching technique to classify the segmented data as normal or abnormal state. Experiments using the data collected from a RIE (reactive ion etching) process show that the proposed method is able to recognize normal/abnormal states with high accuracy.</description><identifier>ISSN: 1523-553X</identifier><identifier>ISBN: 1424411416</identifier><identifier>ISBN: 9781424411412</identifier><identifier>EISBN: 9781424411429</identifier><identifier>EISBN: 1424411424</identifier><identifier>DOI: 10.1109/ISSM.2007.4446846</identifier><language>eng</language><publisher>IEEE</publisher><subject>Event detection ; Fault detection ; Flat panel displays ; Heuristic algorithms ; Manufacturing processes ; Pattern matching ; Process control ; Productivity ; Semiconductor device manufacture ; Technology management</subject><ispartof>2007 International Symposium on Semiconductor Manufacturing, 2007, p.1-4</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4446846$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4446846$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ja Young Choi</creatorcontrib><creatorcontrib>Jong Myoung Ko</creatorcontrib><creatorcontrib>Chang Ouk Kim</creatorcontrib><creatorcontrib>Yoon Seong Kang</creatorcontrib><creatorcontrib>Seung Jun Lee</creatorcontrib><title>Process start/end event detection and dynamic time warping algorithms for run-by-run process fault detection</title><title>2007 International Symposium on Semiconductor Manufacturing</title><addtitle>ISSM</addtitle><description>In semiconductor/FPD (flat panel display) manufacturing environments, APC (advanced process control) is a vital task for enhancing yield. The APC technology improves the productivity of equipments based on two main control mechanisms: fault management and R2R (run-to-run) recipe correction. This paper focuses on FDC (fault detection and classification) for the fault management, and proposes a run-by-run process fault detection method. The method consists of a process event detection algorithm to segment process data, and a pattern matching technique to classify the segmented data as normal or abnormal state. Experiments using the data collected from a RIE (reactive ion etching) process show that the proposed method is able to recognize normal/abnormal states with high accuracy.</description><subject>Event detection</subject><subject>Fault detection</subject><subject>Flat panel displays</subject><subject>Heuristic algorithms</subject><subject>Manufacturing processes</subject><subject>Pattern matching</subject><subject>Process control</subject><subject>Productivity</subject><subject>Semiconductor device manufacture</subject><subject>Technology management</subject><issn>1523-553X</issn><isbn>1424411416</isbn><isbn>9781424411412</isbn><isbn>9781424411429</isbn><isbn>1424411424</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpNkE1LxDAYhCMquK79AeIlf6DdvG2SJkdZ_FhYUdg9eFvS9u0a6RdJVum_t2AFLzPMHB6YIeQWWALA9Gqz270kKWN5wjmXisszEulcAU85h0n1Obn-CyAvyAJEmsVCZO9XJPL-kzEGueRMyAVp3lxfovfUB-PCCruK4hd2gVYYsAy276iZumrsTGtLGmyL9Nu4wXZHappj72z4aD2te0fdqYuLMZ6MDjO0NqfmH-qGXNam8RjNviT7x4f9-jnevj5t1vfb2GoW4lyVkqWGa6gzVkot6mlkKjWXXIvCFCUUUIssR1SKcZUiGlVUYLQshJKgsyW5-8VaRDwMzrbGjYf5q-wHzEJckA</recordid><startdate>200710</startdate><enddate>200710</enddate><creator>Ja Young Choi</creator><creator>Jong Myoung Ko</creator><creator>Chang Ouk Kim</creator><creator>Yoon Seong Kang</creator><creator>Seung Jun Lee</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200710</creationdate><title>Process start/end event detection and dynamic time warping algorithms for run-by-run process fault detection</title><author>Ja Young Choi ; Jong Myoung Ko ; Chang Ouk Kim ; Yoon Seong Kang ; Seung Jun Lee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-78c602a491f30c695f46826946495babc1b1f537ee880482eea8bd1a96b586193</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Event detection</topic><topic>Fault detection</topic><topic>Flat panel displays</topic><topic>Heuristic algorithms</topic><topic>Manufacturing processes</topic><topic>Pattern matching</topic><topic>Process control</topic><topic>Productivity</topic><topic>Semiconductor device manufacture</topic><topic>Technology management</topic><toplevel>online_resources</toplevel><creatorcontrib>Ja Young Choi</creatorcontrib><creatorcontrib>Jong Myoung Ko</creatorcontrib><creatorcontrib>Chang Ouk Kim</creatorcontrib><creatorcontrib>Yoon Seong Kang</creatorcontrib><creatorcontrib>Seung Jun Lee</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library Online</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ja Young Choi</au><au>Jong Myoung Ko</au><au>Chang Ouk Kim</au><au>Yoon Seong Kang</au><au>Seung Jun Lee</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Process start/end event detection and dynamic time warping algorithms for run-by-run process fault detection</atitle><btitle>2007 International Symposium on Semiconductor Manufacturing</btitle><stitle>ISSM</stitle><date>2007-10</date><risdate>2007</risdate><spage>1</spage><epage>4</epage><pages>1-4</pages><issn>1523-553X</issn><isbn>1424411416</isbn><isbn>9781424411412</isbn><eisbn>9781424411429</eisbn><eisbn>1424411424</eisbn><abstract>In semiconductor/FPD (flat panel display) manufacturing environments, APC (advanced process control) is a vital task for enhancing yield. The APC technology improves the productivity of equipments based on two main control mechanisms: fault management and R2R (run-to-run) recipe correction. This paper focuses on FDC (fault detection and classification) for the fault management, and proposes a run-by-run process fault detection method. The method consists of a process event detection algorithm to segment process data, and a pattern matching technique to classify the segmented data as normal or abnormal state. Experiments using the data collected from a RIE (reactive ion etching) process show that the proposed method is able to recognize normal/abnormal states with high accuracy.</abstract><pub>IEEE</pub><doi>10.1109/ISSM.2007.4446846</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 1523-553X |
| ispartof | 2007 International Symposium on Semiconductor Manufacturing, 2007, p.1-4 |
| issn | 1523-553X |
| language | eng |
| recordid | cdi_ieee_primary_4446846 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Event detection Fault detection Flat panel displays Heuristic algorithms Manufacturing processes Pattern matching Process control Productivity Semiconductor device manufacture Technology management |
| title | Process start/end event detection and dynamic time warping algorithms for run-by-run process fault detection |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T06%3A00%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Process%20start/end%20event%20detection%20and%20dynamic%20time%20warping%20algorithms%20for%20run-by-run%20process%20fault%20detection&rft.btitle=2007%20International%20Symposium%20on%20Semiconductor%20Manufacturing&rft.au=Ja%20Young%20Choi&rft.date=2007-10&rft.spage=1&rft.epage=4&rft.pages=1-4&rft.issn=1523-553X&rft.isbn=1424411416&rft.isbn_list=9781424411412&rft_id=info:doi/10.1109/ISSM.2007.4446846&rft_dat=%3Cieee_6IE%3E4446846%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=9781424411429&rft.eisbn_list=1424411424&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4446846&rfr_iscdi=true |