Qualification of immersion double patterning

Semiconductor manufacturers expect 193nm immersion lithography, supplemented by double patterning techniques, to remain the dominant patterning technology through the 32nm technology node. In this work, we examine focus-exposure and overlay data that show potential challenges for qualification and c...

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Bibliographische Detailangaben

Hauptverfasser:	Widmann, A., Monahan, K.M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Lithography Metrology Parameter estimation Production facilities Qualifications Resists Sampling methods Semiconductor device manufacture Temperature Thermal resistance
Online-Zugang:	Volltext bestellen
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