The Effect of SnxAgCu and SnAgCuX on the Mechanical Drop Performance in Lead Free CSP Package

In the study, one 14x14 lead free CSP BGA with 0.3 mm/0.5 mm ball diameter/pitch was adopted as test vehicle. The intermetallic compounds morphology evolution which can be generated when using SnxAgCu and SnAgCuX solder ball in combination with electrolytic NiAu-plated substrates was investigated du...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, J.C.B., Chen, P.C., Yi-Shao Lai
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aging Assembly Chip scale packaging Environmentally friendly manufacturing techniques Intermetallic Lead Morphology Temperature Testing Vehicles
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