Molded underfill technology for low-k flip chip packages

Low-k dielectrics materials in the active layers on the chip surface has become a hot topic as most 90 nm devices and all 65 nm devices utilize low-k dielectrics materials. Low-k dielectrics materials provide a significant increase in performance of the devices but low-k materials have very low mech...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wen-Tsung Tseng, Ho-Yi Tsai, Chiu, S., Hsiao, C.S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	coplanarity Dielectric materials Electronic packaging thermal management Electronics packaging Environmentally friendly manufacturing techniques Flip chip Lead Low-k molding underfill Protection Thermal expansion Thermal stresses Throughput
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