The study of thermal properties and thermal resistant behaviors of siloxane-modified LED transparent encapsulant

In this study, we selected triglycidyl ether terminated Phenylmethylsiloxnae-co-dimethylsiloxne (GT-1000) which was compatible with the diglycidyl ether of bisphenol A epoxy (DER331) to partial replace the epoxy resin and was cured by liquid anhydride (MHHPA). We also synthesized 5, 5'-(1, 1, 3...

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Bibliographische Detailangaben

Hauptverfasser:	Hsun-Tien Li, Chia-Wen Hsu, Kai-Chi Chen
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Displays Epoxy resins Glass LED lamps Light emitting diodes Mechanical factors Temperature Testing Thermal resistance Thermal stability
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