Viscosity of Polymer Paste Materials for Electronics
The article is focused on properties of polymer paste materials these were applied in electronics production. Viscosity of such materials is investigated in particular. Samples of electrically conductive adhesives and electrically conductive pastes for screen printing were chosen for experiment. Vis...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 234 |
|---|---|
| container_issue | |
| container_start_page | 229 |
| container_title | |
| container_volume | |
| creator | Pelikanova, I.B. Tucan, M. Busek, D. |
| description | The article is focused on properties of polymer paste materials these were applied in electronics production. Viscosity of such materials is investigated in particular. Samples of electrically conductive adhesives and electrically conductive pastes for screen printing were chosen for experiment. Viscosity of such materials is influenced on properties and quality final thick film structure. Viscosity was measured by method using the rotational viscometer. The dependence of viscosity on temperature was analyzed. |
| doi_str_mv | 10.1109/ISSE.2007.4432853 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4432853</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4432853</ieee_id><sourcerecordid>4432853</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-b544b17d07ec52965b29a02ad5fbf9295de2bc4e8b97b81bf61b63cc25cfa333</originalsourceid><addsrcrecordid>eNotj9FKwzAUQAMqOGY_QHzJD7Tm3tw0zaOMqoMNBxu-jiRNINJZSfrSv1dwTwfOw4HD2COIBkCY5-3x2DcohG6IJHZK3rDK6A4IiQBB0y1bIbRQo8LunlWlfAkhQLcEQq4Yfabip5LmhU-RH6ZxuYTMD7bMge_tHHKyY-Fxyrwfg5_z9J18eWB38U-H6so1O732p817vft4225ednUCrebaKSIHehA6eIWmVQ6NFWgHFV00aNQQ0HkKnTPadeBiC66V3qPy0Uop1-zpP5tCCOefnC42L-frpvwFWkFF_A</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Viscosity of Polymer Paste Materials for Electronics</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Pelikanova, I.B. ; Tucan, M. ; Busek, D.</creator><creatorcontrib>Pelikanova, I.B. ; Tucan, M. ; Busek, D.</creatorcontrib><description>The article is focused on properties of polymer paste materials these were applied in electronics production. Viscosity of such materials is investigated in particular. Samples of electrically conductive adhesives and electrically conductive pastes for screen printing were chosen for experiment. Viscosity of such materials is influenced on properties and quality final thick film structure. Viscosity was measured by method using the rotational viscometer. The dependence of viscosity on temperature was analyzed.</description><identifier>ISSN: 2161-2528</identifier><identifier>ISBN: 9781424412174</identifier><identifier>ISBN: 142441217X</identifier><identifier>DOI: 10.1109/ISSE.2007.4432853</identifier><language>eng</language><publisher>IEEE</publisher><subject>Conducting materials ; Conductive adhesives ; Electronic components ; Polymers ; Printing ; Production ; Resistors ; Substrates ; Thick films ; Viscosity</subject><ispartof>2007 30th International Spring Seminar on Electronics Technology (ISSE), 2007, p.229-234</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4432853$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4432853$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Pelikanova, I.B.</creatorcontrib><creatorcontrib>Tucan, M.</creatorcontrib><creatorcontrib>Busek, D.</creatorcontrib><title>Viscosity of Polymer Paste Materials for Electronics</title><title>2007 30th International Spring Seminar on Electronics Technology (ISSE)</title><addtitle>ISSE</addtitle><description>The article is focused on properties of polymer paste materials these were applied in electronics production. Viscosity of such materials is investigated in particular. Samples of electrically conductive adhesives and electrically conductive pastes for screen printing were chosen for experiment. Viscosity of such materials is influenced on properties and quality final thick film structure. Viscosity was measured by method using the rotational viscometer. The dependence of viscosity on temperature was analyzed.</description><subject>Conducting materials</subject><subject>Conductive adhesives</subject><subject>Electronic components</subject><subject>Polymers</subject><subject>Printing</subject><subject>Production</subject><subject>Resistors</subject><subject>Substrates</subject><subject>Thick films</subject><subject>Viscosity</subject><issn>2161-2528</issn><isbn>9781424412174</isbn><isbn>142441217X</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj9FKwzAUQAMqOGY_QHzJD7Tm3tw0zaOMqoMNBxu-jiRNINJZSfrSv1dwTwfOw4HD2COIBkCY5-3x2DcohG6IJHZK3rDK6A4IiQBB0y1bIbRQo8LunlWlfAkhQLcEQq4Yfabip5LmhU-RH6ZxuYTMD7bMge_tHHKyY-Fxyrwfg5_z9J18eWB38U-H6so1O732p817vft4225ednUCrebaKSIHehA6eIWmVQ6NFWgHFV00aNQQ0HkKnTPadeBiC66V3qPy0Uop1-zpP5tCCOefnC42L-frpvwFWkFF_A</recordid><startdate>200705</startdate><enddate>200705</enddate><creator>Pelikanova, I.B.</creator><creator>Tucan, M.</creator><creator>Busek, D.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200705</creationdate><title>Viscosity of Polymer Paste Materials for Electronics</title><author>Pelikanova, I.B. ; Tucan, M. ; Busek, D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-b544b17d07ec52965b29a02ad5fbf9295de2bc4e8b97b81bf61b63cc25cfa333</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Conducting materials</topic><topic>Conductive adhesives</topic><topic>Electronic components</topic><topic>Polymers</topic><topic>Printing</topic><topic>Production</topic><topic>Resistors</topic><topic>Substrates</topic><topic>Thick films</topic><topic>Viscosity</topic><toplevel>online_resources</toplevel><creatorcontrib>Pelikanova, I.B.</creatorcontrib><creatorcontrib>Tucan, M.</creatorcontrib><creatorcontrib>Busek, D.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Pelikanova, I.B.</au><au>Tucan, M.</au><au>Busek, D.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Viscosity of Polymer Paste Materials for Electronics</atitle><btitle>2007 30th International Spring Seminar on Electronics Technology (ISSE)</btitle><stitle>ISSE</stitle><date>2007-05</date><risdate>2007</risdate><spage>229</spage><epage>234</epage><pages>229-234</pages><issn>2161-2528</issn><isbn>9781424412174</isbn><isbn>142441217X</isbn><abstract>The article is focused on properties of polymer paste materials these were applied in electronics production. Viscosity of such materials is investigated in particular. Samples of electrically conductive adhesives and electrically conductive pastes for screen printing were chosen for experiment. Viscosity of such materials is influenced on properties and quality final thick film structure. Viscosity was measured by method using the rotational viscometer. The dependence of viscosity on temperature was analyzed.</abstract><pub>IEEE</pub><doi>10.1109/ISSE.2007.4432853</doi><tpages>6</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 2161-2528 |
| ispartof | 2007 30th International Spring Seminar on Electronics Technology (ISSE), 2007, p.229-234 |
| issn | 2161-2528 |
| language | eng |
| recordid | cdi_ieee_primary_4432853 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Conducting materials Conductive adhesives Electronic components Polymers Printing Production Resistors Substrates Thick films Viscosity |
| title | Viscosity of Polymer Paste Materials for Electronics |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T19%3A26%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Viscosity%20of%20Polymer%20Paste%20Materials%20for%20Electronics&rft.btitle=2007%2030th%20International%20Spring%20Seminar%20on%20Electronics%20Technology%20(ISSE)&rft.au=Pelikanova,%20I.B.&rft.date=2007-05&rft.spage=229&rft.epage=234&rft.pages=229-234&rft.issn=2161-2528&rft.isbn=9781424412174&rft.isbn_list=142441217X&rft_id=info:doi/10.1109/ISSE.2007.4432853&rft_dat=%3Cieee_6IE%3E4432853%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4432853&rfr_iscdi=true |