Improvement of plating adhesion on PhotoVia substrates

This paper deals with the microvia substrates. Microvia substrates are high density multilayer printed circuits boards with the reduced diameter of interconnection vias. PhotoVia method was used for the creation of microvias by photolithography. For this method, the photoimageable dielectric materia...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hamacek, A., Kidora, J., Reboun, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adhesives Dielectric materials Dielectric substrates Integrated circuit interconnections Lithography Nonhomogeneous media Printed circuits Rough surfaces Surface roughness Surface treatment
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