Power-cycling of DMOS-switches triggers thermo-mechanical failure mechanisms

Power-cycling of DMOS-switches triggers thermo-mechanical failure mechanisms

In this article the failure behavior of DMOS-switches under power-cycle stress is shown to be dominated by thermo-mechanical deformation of the metallization. The failure evolves without a significant influence from electromigration stress.

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Bibliographische Detailangaben
Hauptverfasser: Smorodin, T., Stecher, M., Wilde, J., Glavanovics, M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Aluminum
Copper
Electromigration
Failure analysis
Metallization
Switches
Temperature
Thermal stresses
Thermomechanical processes
Voltage
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Beschreibung
Zusammenfassung:In this article the failure behavior of DMOS-switches under power-cycle stress is shown to be dominated by thermo-mechanical deformation of the metallization. The failure evolves without a significant influence from electromigration stress.
ISSN:1930-8876
DOI:10.1109/ESSDERC.2007.4430898