Characterization of Wire Bondability on Overhang Structured Chip in Multi Chip Package

Characteristics of wire bonding on the overhang structured chip were investigated in this study. During the wire bonding process, chip crack and bondability were severe factors for thin wafer bonding. Chip crack was investigated by chip strength test and parametric study was performed by changing bo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shin, Dongkil, Kwak, Dongok, Song, Younghee, Chung, Myungkee, Ahn, Eunchul, Cho, Kyoungbok
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding forces Bonding processes Length measurement Packaging Parametric study Performance evaluation Semiconductor device measurement Testing Wafer bonding Wire
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