Reliability Evaluation of Carbon Nanotube Interconnect in a Silicon CMOS Environment

Conventional copper conductor suffered from electromigration induced by high current density. This calls for a more reliable conductive material. Carbon nanotubes (CNTs), with excellent electrical properties and extremely high thermal conductivity, have been suggested for future interconnects. Altho...

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Bibliographische Detailangaben

Hauptverfasser:	Yang Chai, Min Zhang, Jingfeng Gong, Chan, P.C.H.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Carbon nanotubes Conducting materials Copper Current density Electromigration Materials reliability Silicon Testing Thermal conductivity Thermal stresses
Online-Zugang:	Volltext bestellen
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