Numerical analysis and IR scan test for thermal resistance of GaAs MMIC in a communications satellite

Thermal resistance of a 3 GHz power amplifier MMIC has been calculated with finite element (FE) analyses. Through comparative FE analyses it has been found that a carrier for infrared (IR) scan test should have high thermal conductivity if it is for measuring thermal resistance of an MMIC only. IR s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chang Soo Kwak, Ki Burm Ahn, Dong Pil Chang, In Bok Yom
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Artificial satellites Electrical resistance measurement Gallium arsenide IR scan MMIC MMICs Numerical analysis power amplifier Power amplifiers Temperature distribution Testing Thermal conductivity Thermal resistance
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!